Datasheet > 二极管 > 瞬态抑制器> SZESD11A5.0DT5G

SZESD11A5.0DT5G

更新时间： 2024-11-30 11:01:35

品牌	Logo	应用领域
安森美 - ONSEMI		二极管瞬态抑制器
页数	文件大小	规格书
5页	175K
描述
ESD / 浪涌保护器

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中文翻译

获取价格

数据手册

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SZESD11A5.0DT5G 数据手册

ESD11A3.3DT5G SERIES

Transient Voltage

Suppressors

ESD Protection Diodes in Ultra Small

SOT−1123 Package

The ESD11A Series is designed to protect voltage sensitive

components from damage due to ESD. These parts provide excellent

ESD clamping capability and fast response time to enhance the

immunity of the end application from system level ESD stress such as

IEC61000−4−2. Two uni−directional TVS diodes are housed in the ultra

small SOT−1123 package, making these parts ideal for ESD protection

on designs where board space is at a premium, such as cell phones, MP3

players and many other portable handheld electronic devices.

http://onsemi.com

PIN 1. CATHODE

2. CATHODE

3. ANODE

MARKING

DIAGRAM

Specification Features:

• Low Clamping Voltage

• Small Body Outline Dimensions:

0.039” x 0.024” (1.0 mm x 0.6 mm)

• Low Body Height: 0.016″ (0.4 mm)

• Stand−off Voltage: 3.3 V − 5 V

• Low Leakage

X M

SOT−1123

CASE 524AA

= Specific Device Code

M = Date Code

• Response Time is Typically < 1 ns

• IEC61000−4−2 Level 4 ESD Protection

• These are Pb−Free Devices

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

†

Device

Package

Shipping

ESD11AxxDT5G SOT−1123 8000/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MAXIMUM RATINGS

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the table on page 2 of this data sheet.

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Total Power Dissipation on FR−5 Board

°P °

150

(Note 1) @ T = 25°C

Storage Temperature Range

Junction Temperature Range

−55 to +150

−55 to +125

260

°C

stg

Lead Solder Temperature − Maximum

(10 Second Duration)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of ESD maximum ratings.

Publication Order Number:

October, 2009 − Rev. 1

ESD11A3.3D/D

12 3 4 5

中文翻译

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