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SZ1SMB5936T3G PDF预览

SZ1SMB5936T3G

更新时间： 2024-02-13 15:12:01
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 168K
描述
3 Watt Plastic Surface Mount Zener Voltage Regulators

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SZ1SMB5936T3G 数据手册

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1SMB59xxBT3G Series,  
SZ1SMB59xxT3G Series  
3 Watt Plastic  
Surface Mount  
Zener Voltage Regulators  
This complete new line of 3 W Zener diodes offers the following  
advantages.  
http://onsemi.com  
PLASTIC SURFACE MOUNT  
ZENER VOLTAGE  
REGULATOR DIODES  
3.3−200 V, 3 W DC POWER  
Features  
Zener Voltage Range − 3.3 V to 200 V  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Flat Handling Surface for Accurate Placement  
Package Design for Top Side or Bottom Circuit Board Mounting  
AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
SMB  
CASE 403A  
PLASTIC  
Pb−Free Packages are Available*  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded plastic  
FINISH: All external surfaces are corrosion resistant and leads are  
readily solderable  
Cathode  
Anode  
MARKING DIAGRAM  
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
LEADS: Modified L−Bend providing more contact area to bond pads  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
AYWW  
9xxB G  
G
MAXIMUM RATINGS  
A
Y
= Assembly Location  
= Year  
Rating  
Symbol Value  
Unit  
WW = Work Week  
9xxB = Device Code (Refer to page 3)  
Maximum Steady State Power  
Dissipation @ T = 75C  
P
D
3.0  
W
L
Measured at Zero Lead Length  
Derate Above 75C  
Thermal Resistance from Junction−to−Lead  
G
= Pb−Free Package  
40  
25  
mW/C  
C/W  
(Note: Microdot may be in either location)  
R
q
JL  
Maximum Steady State Power  
ORDERING INFORMATION  
Dissipation @ T = 25C (Note )  
P
550  
4.4  
226  
mW  
mW/C  
C/W  
A
D
Derate Above 25C  
Thermal Resistance from  
Junction−to−Ambient  
†
Device  
Package  
Shipping  
R
q
JA  
1SMB59xxBT3G  
SMB  
2,500 /  
(Pb−Free)  
Tape & Reel  
Operating and Storage Temperature Range  
T , T  
−65 to  
+150  
C  
J
stg  
SZ1SMB59xxBT3G  
SMB  
2,500 /  
(Pb−Free)  
Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−4 board, using recommended footprint.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 − Rev. 8  
1SMB5913BT3/D  
123456

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