生命周期: | Obsolete | 包装说明: | , 0805 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8532.21.00.50 | 风险等级: | 5.75 |
电容: | 2.2 µF | 电容器类型: | TANTALUM CAPACITOR |
介电材料: | TANTALUM (DRY/SOLID) | 安装特点: | SURFACE MOUNT |
负容差: | 20% | 端子数量: | 2 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装形状: | RECTANGULAR PACKAGE | 包装方法: | BULK |
极性: | POLARIZED | 正容差: | 20% |
额定(直流)电压(URdc): | 4 V | 尺寸代码: | 0805 |
表面贴装: | YES | Delta切线: | 0.1 |
端子形状: | WRAPAROUND | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SVSP0G226M | NEC |
获取价格 |
CAPACITOR, TANTALUM, SOLID, POLARIZED, 4V, 22uF, SURFACE MOUNT, 0805, CHIP | |
SVSP0G335M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0G475M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0G475M | RENESAS |
获取价格 |
CAPACITOR, TANTALUM, SOLID, POLARIZED, 4 V, 4.7 uF, SURFACE MOUNT, 0805, CHIP | |
SVSP0G685M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J105M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J105M | RENESAS |
获取价格 |
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3 V, 1 uF, SURFACE MOUNT, 0805, CHIP | |
SVSP0J106M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J155M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J225M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip |