是否无铅: | 含铅 | 生命周期: | Obsolete |
包装说明: | , 0805 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8532.21.00.50 |
风险等级: | 5.72 | 电容: | 4.7 µF |
电容器类型: | TANTALUM CAPACITOR | 介电材料: | TANTALUM (DRY/SOLID) |
漏电流: | 0.0005 mA | 安装特点: | SURFACE MOUNT |
负容差: | 20% | 端子数量: | 2 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装形状: | RECTANGULAR PACKAGE | 包装方法: | BULK |
极性: | POLARIZED | 正容差: | 20% |
额定(直流)电压(URdc): | 4 V | 尺寸代码: | 0805 |
表面贴装: | YES | Delta切线: | 0.2 |
端子形状: | J BEND | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SVSP0G685M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J105M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J105M | RENESAS |
获取价格 |
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3 V, 1 uF, SURFACE MOUNT, 0805, CHIP | |
SVSP0J106M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J155M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J225M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J335M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J475M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip | |
SVSP0J475M | RENESAS |
获取价格 |
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3 V, 4.7 uF, SURFACE MOUNT, 0805, CHIP | |
SVSP0J685M | NEC |
获取价格 |
Surface mount resin molded, Ultra miniaturized chip |