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STLC2411 PDF预览

STLC2411

更新时间: 2024-02-01 01:23:18
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 电信集成电路电信电路蓝牙
页数 文件大小 规格书
25页 221K
描述
BLUETOOTH BASEBAND

STLC2411 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:8 X 8 MM, 1.20 MM HEIGHT, TFBGA-132针数:132
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.78JESD-30 代码:S-PBGA-B132
JESD-609代码:e0长度:8 mm
功能数量:1端子数量:132
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA132,14X14,20封装形状:SQUARE
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8,3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Other Telecom ICs
标称供电电压:1.8 V表面贴装:YES
技术:CMOS电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

STLC2411 数据手册

 浏览型号STLC2411的Datasheet PDF文件第19页浏览型号STLC2411的Datasheet PDF文件第20页浏览型号STLC2411的Datasheet PDF文件第21页浏览型号STLC2411的Datasheet PDF文件第22页浏览型号STLC2411的Datasheet PDF文件第23页浏览型号STLC2411的Datasheet PDF文件第24页 
STLC2411  
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
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The BLUETOOTH™ word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by STMicroelectronics is under license.  
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