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STDELIV

更新时间： 2024-09-08 23:35:03

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ORDERING INFORMATION FOR PACKAGE AND DELIVERY

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STDELIV 数据手册

SMARTCARD MCU

Ordering Information

For Package And Delivery

DATA BRIEFING

INTRODUCTION

The manufacturing process of Smartcards in-

volves various components and technologies in

order to issue a finished product:

– micromodules,

– flat packages,

– wafers.

Table 1. Micromodules in super 35 standard

tape

Type

D1, D2

D15

Description

8 contacts for memory cards

6 contacts for memory cards

8 contacts with ring MCU cards

D3, D4

■ MICROMODULES

Dedicated package for Smartcard products, the

micromodule type depends on the size of the

product and on the application.

8 contacts for dual contact contactless

MCU cards

D68

8 contacts for MCU cards

Table 1 lists all available micromodules.

■ FLAT PACKAGES

6 contacts for dual contact contactless

MCU cards

For applications which require surface mount tech-

nology, suitable for PC cards, or other security

modules, STMicroelectronics offers flat packages

listed In Table 2.

Full contactless for MCU cards

8 contacts for MCU cards

■ WAFERS

For issuer production need, ST offers sawn and

unsawn wafers deliveries, listed in Table 3.

Table 2. Flat Packages

Type

Figure 1. Delivery form

Description

O20

QF4

R20

SO20 for MCU products

TQFP44 for MCU products

SO20

SO20 on tape and reel for MCU products

Table 3. Wafers

Type

261a.ai

Description

Micromodule

W00

W20

W40

S2x

R4x

S4x

T4x

Unsawn wafers, 750 µm thickness

Unsawn wafers, 275 µm thickness

Unsawn wafers, 180 µm thickness

280 µm sawn wafers on UV tape

180 µm sawn wafers on insolated UV tape

180 µm sawn wafers on UV tape

180 µm sawn wafers on blue tape

Notch

8” Wafer

September 2001

1/2

This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact

your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29.

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