2 Megabit Flash + 1 Megabit SRAM ComboMemory
SST31LH021
Advance Information
FEATURES:
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Organized as 256K x8 flash + 128K x8 SRAM
Single 3.0-3.6V Read and Write Operations
Concurrent Operation
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Latched Address and Data for Flash
1
Flash Fast Sector-Erase and Byte-Program:
– Sector-Erase Time: 18 ms (typical)
– Bank-Erase Time: 70 ms (typical)
– Byte-Program Time: 14 µs (typical)
– Bank Rewrite Time: 4 seconds (typical)
– Read from or Write to SRAM while
Erase/Program Flash
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Superior Reliability
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Flash Automatic Erase and Program Timing
– Internal VPP Generation
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
3
Flash End of Write Detection
Low Power Consumption:
– Toggle Bit
– Data# Polling
4
– Active Current: 10 mA (typical) for Flash
and 20 mA (typical) for SRAM Read
– Standby Current: 700 µA (typical)
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CMOS I/O Compatibility
JEDEC Standard Command Set
Packages Available
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Sector-Erase Capability
– Uniform 4 KByte sectors
Fast Read Access Times:
5
– 32-Pin TSOP (8mm x 14mm)
– 40-Pin TSOP (10mm x 14mm)
6
– Flash: 70 ns
– SRAM: 25 ns
7
PRODUCT DESCRIPTION
signal, BEF# selects the flash memory bank. The WE#
signal has to be used with Software Data Protection
(SDP) command sequence when controlling the Erase
and Program operations in the flash memory bank. The
SDPcommandsequenceprotectsthedatastoredinthe
flash memory bank from accidental alteration.
The SST31LH021 is a 256K x8 CMOS flash memory
bank combined with a 128K x8 CMOS SRAM memory
bank manufactured with SST’s proprietary, high perfor-
mance SuperFlash technology. The SST31LH021 de-
vice writes (SRAM or flash) with a 3.0-3.6V power
supply.ThemonolithicSST31LH021deviceconformsto
JEDEC standard pinouts and Software Data Protect
(SDP) commands for x8 EEPROMs in TSOP packages.
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The SST31LH021 provides the added functionality of
being able to simultaneously read from or write to the
SRAM bank while erasing or programming in the flash
memory bank. The SRAM memory bank can be read or
written while the flash memory bank performs Sector-
Erase, Bank-Erase, or Byte-Program concurrently. All
flash memory Erase and Program operations will auto-
matically latch the input address and data signals and
complete the operation in background without further
input stimulus requirement. Once the internally con-
trolled Erase or Program cycle in the flash bank has
commenced,theSRAMbankcanbeaccessedforRead
or Write.
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Featuring high performance Byte-Program, the flash
memory bank provides a maximum Byte-Program time
of 20 µsec. The entire flash memory bank can be erased
and programmed byte-by-byte in typically 4 seconds,
when using interface features such as Toggle Bit or
Data# Polling to indicate the completion of Program
operation. To protect against inadvertent flash write, the
SST31LH021 device has on-chip hardware and soft-
ware data protection schemes. Designed, manufac-
tured,andtestedforawidespectrumofapplications,the
SST31LH021deviceisofferedwithaguaranteedendur-
ance of 10,000 cycles. Data retention is rated at greater
than 100 years.
The SST31LH021 device is suited for applications that
use both nonvolatile flash memory and volatile SRAM
memory to store code or data. For all system applica-
tions, the SST31LH021 device significantly improves
performance and reliability, while lowering power con-
sumption, when compared with multiple chip solutions.
The SST31LH021 inherently uses less energy during
Erase and Program than alternative flash technologies.
When programming a flash device, the total energy
consumed is a function of the applied voltage, current,
and time of application. Since for any given voltage
TheSST31LH021operatesastwoindependentmemory
banks with respective bank enable signals. The SRAM
andFlashmemorybanksaresuperimposedinthesame
memory address space. Both memory banks share
common address lines, data lines, WE# and OE#. The
memory bank selection is done by memory bank enable
signals. The SRAM bank enable signal, BES# selects
the SRAM bank and the flash memory bank enable
© 1999 Silicon Storage Technology, Inc.
353-11 11/99
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