Datasheet > SSM6L35FE(TPL3)

SSM6L35FE(TPL3)

更新时间： 2024-01-01 14:17:36

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
8页	218K
描述
TRANSISTOR,MOSFET,PAIR,COMPLEMENTARY,20V V(BR)DSS,180MA I(D),SOT-363VAR

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SSM6L35FE(TPL3) 数据手册

SSM6L35FE

TOSHIBA Field-Effect Transistor Silicon N / P Channel MOS Type

SSM6L35FE

○High-Speed Switching Applications

Unit: mm

1.6±0.05

○Analog Switch Applications

1.2±0.05

•

N-ch: 1.2-V drive

P-ch: 1.2-V drive

N-ch, P-ch, 2-in-1

•

Low ON-resistance Q1 N-ch: R = 20 Ω (max) (@V

= 1.2 V)

= 1.5 V)

= 2.5 V)

= 4.0 V)

= -1.2 V)

= -1.5 V)

= -2.5 V)

= -4.0 V)

: R

8 Ω (max) (@V

4 Ω (max) (@V

3 Ω (max) (@V

Q2 P-ch: R = 44 Ω (max) (@V

: R = 22 Ω (max) (@V

: R = 11 Ω (max) (@V

: R

8 Ω (max) (@V

1.Source1 4.Source2

2.Gate1

3.Drain2

5.Gate2

6.Drain1

Q1 Absolute Maximum Ratings (Ta = 25°C)

ES6

Characteristics

Drain–source voltage

Symbol

Rating

Unit

JEDEC

JEITA

DSS

Gate–source voltage

±10

180

360

GSS

TOSHIBA

2-2N1D

Drain current

Pulse

Weight: 3.0 mg (typ.)

Q2 Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Drain–source voltage

Symbol

Rating

Unit

-20

±10

DSS

Gate–source voltage

GSS

-100

-200

Drain current

Pulse

Absolute Maximum Ratings (Ta = 25 °C) (Common to the Q1, Q2)

Characteristic

Symbol

P (Note 1)

Rating

Unit

Drain power dissipation

Channel temperature

150

°C

Storage temperature range

stg

−55 to 150

°C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if

the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report

and estimated failure rate, etc).

Note 1: Total rating

Mounted on an FR4 board

(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.135 mm²× 6)

2008-03-21

12 3 4 5 6 7 8

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