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SSM3K329R,LF PDF预览

SSM3K329R,LF

更新时间: 2024-02-09 21:34:55
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
7页 216K
描述
MOSFET, SOT23F

SSM3K329R,LF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F3Reach Compliance Code:unknown
Factory Lead Time:12 weeks风险等级:1.69
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (ID):3.5 A最大漏源导通电阻:0.126 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-F3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSM3K329R,LF 数据手册

 浏览型号SSM3K329R,LF的Datasheet PDF文件第2页浏览型号SSM3K329R,LF的Datasheet PDF文件第3页浏览型号SSM3K329R,LF的Datasheet PDF文件第4页浏览型号SSM3K329R,LF的Datasheet PDF文件第5页浏览型号SSM3K329R,LF的Datasheet PDF文件第6页浏览型号SSM3K329R,LF的Datasheet PDF文件第7页 
SSM3K329R  
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type  
SSM3K329R  
Power Management Switch Applications  
High-Speed Switching Applications  
Unit: mm  
+0.08  
-0.05  
0.42  
+0.08  
-0.07  
0.17  
0.05ꢀM A  
1.8-V drive  
3
Low ON-resistance: R  
= 289 m(max) (@V  
= 1.8 V)  
= 2.5 V)  
= 4.0 V)  
DS(ON)  
DS(ON)  
DS(ON)  
GS  
GS  
GS  
: R  
: R  
= 170 m(max) (@V  
= 126 m(max) (@V  
1
2
0.95  
0.95  
Absolute Maximum Ratings (Ta = 25°C)  
2.9±0.2  
A
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
30  
V
V
DSS  
Gate-source voltage  
±12  
GSS  
1. Gate  
2. Source  
3. Drain  
DC  
I
3.5  
D
Drain current  
A
Pulse  
I
7.0  
DP  
P
(Note 1)  
1
2
D
SOT-23F  
Power dissipation  
W
t = 10s  
JEDEC  
Channel temperature  
T
150  
°C  
°C  
ch  
JEITA  
Storage temperature range  
T
stg  
55 to 150  
TOSHIBA  
2-3Z1A  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
Weight: 11 mg (typ.)  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are  
within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: The channel temperature should not exceed 150°C during use.  
Note 2: Mounted on a FR4 board.  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)  
1
2010-06-10  

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