SSM3J144TU
6. Electrical Characteristics
6.1. Static Characteristics (Ta = 25ꢁ unless otherwise specified)
Characteristics
Gate leakage current
Symbol
Test Condition
Min
Typ.
Max
Unit
IGSS
IDSS
VGS = -8/+6 V, VDS = 0 V
VDS = -20 V, VGS = 0 V
ꢀ
ꢀ
ꢀ
ꢀ
±1
-1
µA
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
V(BR)DSS ID = -1 mA, VGS = 0 V
-20
-15
-0.3
ꢀ
ꢀ
ꢀ
V
(Note 1) V(BR)DSX ID = -1 mA, VGS = 5 V
ꢀ
ꢀ
(Note 2)
Vth
VDS = -3 V, ID = -1 mA
ꢀ
-1.0
93
Drain-source on-resistance
(Note 3) RDS(ON) ID = -1.5 A, VGS = -4.5 V
ID = -1.0 A, VGS = -2.5 V
78.5
97.5
120
141
5.8
mΩ
ꢀ
123
168
240
ꢀ
ID = -0.5 A, VGS = -1.8 V
ꢀ
ID = -0.25 A, VGS = -1.5 V
ꢀ
Forward transfer admittance
(Note 3)
|Yfs|
VDS = -3 V, ID = -1.0 A
2.9
S
Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-1 mA for
this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
6.2. Dynamic Characteristics (Ta = 25ꢁ unless otherwise specified)
Characteristics
Input capacitance
Symbol
Test Condition
Min
Typ.
Max
Unit
pF
Ciss
Crss
Coss
ton
VDS = -10 V, VGS = 0 V,
f = 1 MHz
ꢀ
ꢀ
ꢀ
ꢀ
290
32
ꢀ
ꢀ
ꢀ
ꢀ
Reverse transfer capacitance
Output capacitance
44
Switching time (turn-on time)
VDD = -10 V, ID = -0.5 A
VGS = 0 to -2.5 V, RG = 4.7 Ω
Duty ≤ 1%, Input: tr, tf < 5 ns
Common source
12
ns
Switching time (turn-off time)
toff
ꢀ
46.2
ꢀ
6.3. Switching Time Test Circuit
Fig. 6.3.1 Test Circuit of Switching Time
Fig. 6.3.2 Input Waveform/Output Waveform
©2017-2021
Toshiba Electronic Devices & Storage Corporation
2021-06-25
Rev.2.0
3