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SSM3J14T(T5LPAS,E)

更新时间: 2024-01-15 08:01:36
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
6页 221K
描述
Small Signal Field-Effect Transistor, 2.7A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-Oxide Semiconductor FET

SSM3J14T(T5LPAS,E) 数据手册

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SSM3J14T  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSII)  
SSM3J14T  
Power Management Switch  
DC-DC Converters  
Unit: mm  
Suitable for high-density mounting due to compact package  
Low on Resistance: R = 145 m(max) (@V = 4.5 V)  
on  
GS  
: R = 85 m(max) (@V  
= 10 V)  
GS  
on  
High-speed switching  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
30  
±20  
2.7  
V
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
D
Drain current  
A
I
DP  
Pulse  
5.4  
(Note 2)  
t = 10 s  
(Note 1)  
P
1.25  
0.7  
D
Drain power dissipation  
Channel temperature  
W
JEDEC  
JEITA  
T
150  
°C  
°C  
ch  
TOSHIBA  
2-3S1A  
Storage temperature range  
T
55 to 150  
stg  
Weight: 10 mg (typ.)  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating  
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board  
(25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm2)  
Note 2: The pulse width limited by maximum channel temperature.  
Marking  
Equivalent Circuit  
3
3
KDL  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is  
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
The Channel-to-Ambient thermal resistance R  
and the drain power dissipation P vary according to the  
th (ch-a)  
D
board material, board area, board thickness and pad area, and are also affected by the environment in which the  
product is used. When using this device, please take heat dissipation fully into account  
Start of commercial production  
2001-07  
1
2014-03-01  

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