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SP0002-04966 PDF预览

SP0002-04966

更新时间: 2024-11-11 03:31:27
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管双极性晶体管
页数 文件大小 规格书
4页 36K
描述
IGBT Chip in Fieldstop -technology

SP0002-04966 技术参数

生命周期:Not Recommended包装说明:,
Reach Compliance Code:compliant风险等级:5.65
Is Samacsys:NBase Number Matches:1

SP0002-04966 数据手册

 浏览型号SP0002-04966的Datasheet PDF文件第2页浏览型号SP0002-04966的Datasheet PDF文件第3页浏览型号SP0002-04966的Datasheet PDF文件第4页 
SIGC42T120CQ  
IGBT Chip in Fieldstop -technology  
FEATURES:  
·
·
·
·
1200V Fieldstop technology 120µm chip  
low turn-off losses  
short tail current  
This chip is used for:  
IGBT Modules  
C
E
·
positive temperature coefficient  
Applications:  
welding, SMPS, resonant  
applications  
G
·
Chip Type  
VCE  
ICn  
Die Size  
Package  
Ordering Code  
SIGC42T120CQ 1200V 25A  
6.59 x 6.49 mm2  
sawn on foil SP0002-04966  
MECHANICAL PARAMETER:  
mm2  
Raster size  
6.59 x 6.49  
Emitter pad size  
Gate pad size  
2 x (2.18 x 1.58)  
1.06 x 0.65  
42.8 / 33.5  
120  
Area total / active  
Thickness  
µm  
mm  
grd  
Wafer size  
150  
Flat position  
90  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
332 pcs  
Photoimide  
3200 nm Al Si Cu  
1400 nm Ni Ag –system  
Collector metallization  
Die bond  
suitable for epoxy and soft solder die bonding  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AIM PMD D CID CLS, L7151Q, Rev. 1.1, 20.12.2005  

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