NUP2114 Series,
SNUP2114UCMR6T1G
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
http://onsemi.com
The NUP2114 transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and high level
of ESD protection makes this device well suited for use in USB 2.0
applications.
SOT−553
CASE 463B
TSOP−6
CASE 318G
Features
Low Capacitance 0.8 pF
V
P
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
AEC−Q101 Qualified and PPAP Capable − SNUP2114
Low Clamping Voltage
I/O
I/O
Stand Off Voltage: 5 V
Low Leakage
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 ESD Protection
V
N
MARKING DIAGRAMS
UL Flammability Rating of 94 V−0
These are Pb−Free Devices
P2M MG
P2MG
G
G
1
1
Typical Applications
SOT−553
TSOP−6
High Speed Communication Line Protection
USB 2.0 High Speed Data Line and Power Line Protection
Monitors and Flat Panel Displays
MP3
P2, P2M= Specific Device Code
M
G
= Date Code
= Pb−Free Package
(*Note: Microdot may be in either location)
Gigabit Ethernet
Notebook Computers
PIN CONNECTIONS
Digital Video Interface (DVI) and HDMI
1
2
3
5
V
I/O
P
MAXIMUM RATINGS (T = 25C unless otherwise noted)
J
V
N
Rating
Symbol
Value
−40 to +125
−55 to +150
260
Unit
C
Operating Junction Temperature Range
Storage Temperature Range
T
J
4
NC
I/O
I/O
T
stg
C
SOT−553
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
C
1
2
3
6
5
4
I/O
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Contact
IEC61000−4−2 Air
ESD
16000
400
8000
15000
V
V
N
V
P
NC
NC
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
TSOP−6
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
See Application Note AND8308/D for further description of
survivability specs.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
March, 2012 − Rev. 1
NUP2114/D