ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢈ ꢉꢊ ꢀꢁꢋ ꢃꢄꢅ ꢆꢇ ꢈꢉ
ꢃ ꢌꢍꢎ ꢏ ꢀꢐ ꢁꢑꢒꢓꢔ ꢁꢔ ꢕꢀ ꢍꢎ ꢁꢉꢓꢐ ꢑꢔ ꢕ ꢁꢏ ꢖꢓ ꢀ
SCLS405E − APRIL 1998 − REVISED DECEMBER 2004
D
D
D
2-V to 5.5-V V
Operation
D
D
D
Synchronous Counting
CC
Max t of 9.5 ns at 5 V
Synchronously Programmable
pd
Typical V
<0.8 V at V
(Output Ground Bounce)
I
Supports Partial-Power-Down Mode
OLP
CC
off
= 3.3 V, T = 25°C
Operation
A
D
D
Typical V
>2.3 V at V
(Output V
Undershoot)
D
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
OHV
CC
OH
= 3.3 V, T = 25°C
A
Support Mixed-Mode Voltage Operation on
All Ports
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
D
Internal Look Ahead for Fast Counting
Carry Output for n-Bit Cascading
− 1000-V Charged-Device Model (C101)
D
SN54LV163A . . . J OR W PACKAGE
SN74LV163A . . . D, DB, DGV, NS,
OR PW PACKAGE
SN74LV163A . . . RGY PACKAGE
(TOP VIEW)
SN54LV163A . . . FK PACKAGE
(TOP VIEW)
(TOP VIEW)
1
16
CLR
CLK
A
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
RCO
3
2
1 20 19
18
CLK
A
15
14
13
12
11
10
2
3
4
5
6
7
RCO
A
B
Q
Q
4
5
6
7
8
A
B
Q
17
16
15
14
A
Q
Q
Q
Q
A
B
C
D
B
C
D
Q
B
NC
C
NC
B
C
D
Q
C
Q
Q
C
D
Q
D
ENT
D
9 10 11 12 13
ENP
ENP
GND
ENT
LOAD
8
9
NC − No internal connection
description/ordering information
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
SN74LV163ARGYR
SN74LV163AD
QFN − RGY
SOIC − D
Reel of 1000
Tube of 40
LV163A
LV163A
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 90
SN74LV163ADR
SN74LV163ANSR
SN74LV163ADBR
SN74LV163APW
SN74LV163APWR
SN74LV163APWT
SN74LV163ADGVR
SNJ54LV163AJ
SOP − NS
74LV163A
LV163A
SSOP − DB
−40°C to 85°C
Reel of 2000
Reel of 250
Reel of 2000
Tube of 25
TSSOP − PW
LV163A
TVSOP − DGV
CDIP − J
LV163A
SNJ54LV163AJ
SNJ54LV163AW
SNJ54LV163AFK
−55°C to 125°C
CFP − W
Tube of 150
Tube of 55
SNJ54LV163AW
SNJ54LV163AFK
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
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