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SCBS679K − DECEMBER 1996 − REVISED SEPTEMBER 2003
D
D
D
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
D
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
)
CC
Support Unregulated Battery Operation
Down to 2.7 V
D
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
A
I
and Power-Up 3-State Support Hot
off
Insertion
SN54LVTH240 . . . FK PACKAGE
SN54LVTH240 . . . J OR W PACKAGE
SN74LVTH240 . . . DB, DW, NS,
OR PW PACKAGE
SN74LVTH240 . . . RGY PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
1
20
3
2
1 20 19
18
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1Y1
17 2A4
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
16
15
14
1Y2
2A3
1Y3
9 10 11 12 13
10
11
description/ordering information
These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) V
capability to provide a TTL interface to a 5-V system environment.
operation, but with the
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QFN − RGY
SOIC − DW
Tape and reel SN74LVTH240RGYR
LXH240
Tube
SN74LVTH240DW
LVTH240
Tape and reel SN74LVTH240DWR
Tape and reel SN74LVTH240NSR
Tape and reel SN74LVTH240DBR
SOP − NS
LVTH240
LXH240
SSOP − DB
−40°C to 85°C
Tube
SN74LVTH240PW
TSSOP − PW
LXH240
LXH240
Tape and reel SN74LVTH240PWR
SN74LVTH240GQNR
VFBGA − GQN
VFBGA − ZQN (Pb-free)
CDIP − J
Tape and reel
SN74LVTH240ZQNR
Tube
Tube
Tube
SNJ54LVTH240J
SNJ54LVTH240W
SNJ54LVTH240FK
SNJ54LVTH240J
SNJ54LVTH240W
SNJ54LVTH240FK
CFP − W
−55°C to 125°C
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
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