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SN74LVC3G14DCUTE4 PDF预览

SN74LVC3G14DCUTE4

更新时间: 2024-02-11 02:00:26
品牌 Logo 应用领域
德州仪器 - TI 光电二极管逻辑集成电路触发器
页数 文件大小 规格书
17页 859K
描述
Triple Schmitt-Trigger Inverter 8-VSSOP -40 to 125

SN74LVC3G14DCUTE4 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:VSSOP, TSSOP8,.12,20针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.21
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:2.3 mm
负载电容(CL):50 pF逻辑集成电路类型:INVERTER
最大I(ol):0.024 A湿度敏感等级:1
功能数量:3输入次数:1
端子数量:8最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:VSSOP封装等效代码:TSSOP8,.12,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:5.4 ns
传播延迟(tpd):9.2 ns认证状态:Not Qualified
施密特触发器:YES座面最大高度:0.9 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2 mmBase Number Matches:1

SN74LVC3G14DCUTE4 数据手册

 浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第2页浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第3页浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第4页浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第5页浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第6页浏览型号SN74LVC3G14DCUTE4的Datasheet PDF文件第7页 
SN74LVC3G14  
www.ti.com  
SCES367J AUGUST 2001REVISED NOVEMBER 2013  
Triple Schmitt-Trigger Inverter  
Check for Samples: SN74LVC3G14  
1
FEATURES  
DESCRIPTION  
This triple Schmitt-trigger inverter is designed for  
1.65-V to 5.5-V VCC operation.  
2
Available in the Texas Instruments NanoFree™  
Package  
The SN74LVC3G14 contains three inverters and  
performs the Boolean function Y = A. The device  
functions as three independent inverters but, because  
of Schmitt action, it may have different input threshold  
levels for positive-going (VT+) and negative-going  
(VT–) signals.  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.4 ns at 3.3 V  
Low Power Consumption, 10-μA Max ICC  
±24-mA Output Drive at 3.3 V  
NanoFree™ package technology is  
a
major  
Typical VOLP (Output Ground Bounce) <0.8 V at  
VCC = 3.3 V, TA = 25°C  
breakthrough in IC packaging concepts, using the die  
as the package.  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
This device is fully specified for partial-power-down  
applications using Ioff. The Ioff circuitry disables the  
outputs, preventing damaging current backflow  
through the device when it is powered down.  
Ioff Feature Supports Live Insertion, Partial-  
Power-Down Mode and Back Drive Protection  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
GND  
2A  
2Y  
3A  
VCC  
1Y  
3A  
2Y  
1
2
3
4
8
7
6
5
1A  
3Y  
VCC  
1Y  
3A  
2Y  
1
2
3
4
8
7
6
5
1A  
3Y  
3 6  
2 7  
1 8  
3Y  
1Y  
2A  
VCC  
1A  
GND  
2A  
GND  
See mechanical drawings for dimensions.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2001–2013, Texas Instruments Incorporated  
 

SN74LVC3G14DCUTE4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC3G14DCURG4 TI

完全替代

具有施密特触发输入的 3 通道、1.65V 至 5.5V 反相器 | DCU | 8 |
SN74LVC3G14DCUTG4 TI

完全替代

具有施密特触发输入的 3 通道、1.65V 至 5.5V 反相器 | DCU | 8 |

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