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SN74LVC3G07DCUTG4 PDF预览

SN74LVC3G07DCUTG4

更新时间： 2024-11-16 03:22:47
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
12页 405K
描述
TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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SN74LVC3G07DCUTG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：VSSOP, TSSOP8,.12,20针数：8
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.19系列：LVC/LCX/Z
JESD-30 代码：R-PDSO-G8JESD-609代码：e4
长度：2.3 mm负载电容（CL）：50 pF
逻辑集成电路类型：BUFFER最大I（ol）：0.032 A
湿度敏感等级：1功能数量：3
输入次数：1端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
输出特性：OPEN-DRAIN封装主体材料：PLASTIC/EPOXY
封装代码：VSSOP封装等效代码：TSSOP8,.12,20
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法：TR峰值回流温度（摄氏度）：260
电源：3.3 V最大电源电流（ICC）：0.01 mA
Prop。Delay @ Nom-Sup：3.7 ns传播延迟（tpd）：7.8 ns
认证状态：Not Qualified施密特触发器：NO
座面最大高度：0.9 mm子类别：Gates
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：1.65 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：AUTOMOTIVE
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.5 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：2 mm
Base Number Matches：1

SN74LVC3G07DCUTG4 数据手册

 浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第2页浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第3页浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第4页浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第5页浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第6页浏览型号SN74LVC3G07DCUTG4的Datasheet PDF文件第7页 
SN74LVC3G07  
TRIPLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
www.ti.com  
SCES365J–AUGUST 2001–REVISED FEBRUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
•
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
•
•
•
•
•
Supports 5-V VCC Operation  
Max tpd of 3.7 ns at 3.3 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
Input and Open-Drain Output Accepts  
Voltages up to 5.5 V  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
1000-V Charged-Device Model (C101)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
2Y  
3A  
1Y  
GND  
2A  
3Y  
1A  
3Y  
2A  
V
CC  
1
2
3
4
8
7
6
5
3 6  
1
2
8
7
1A  
3Y  
V
CC  
1Y  
3A  
2Y  
2
7
1A  
1 8  
V
CC  
1Y  
GND  
3
4
6
5
2A  
3A  
2Y  
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
_ _ _CV  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC3G07YZPR  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC3G07DCTR  
SN74LVC3G07DCUR  
SN74LVC3G07DCUT  
C07_ _ _  
–40°C to 85°C  
VSSOP – DCU  
C07_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...12

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SN74LVC3G07DCUTG4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC3G07QDCURQ1 TI

完全替代

 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SN74LVC3G07DCURE4 TI

完全替代

 TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS
SN74LVC3G07DCUR TI

完全替代

 TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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