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SN74LVC3G07DCURE4 PDF预览

SN74LVC3G07DCURE4

更新时间： 2024-01-21 22:08:02
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德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 339K
描述
TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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SN74LVC3G07DCURE4 数据手册

 浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第2页浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第3页浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第4页浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第5页浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第6页浏览型号SN74LVC3G07DCURE4的Datasheet PDF文件第7页 
SN74LVC3G07  
TRIPLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
www.ti.com  
SCES365H–AUGUST 2001–REVISED JUNE 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1A  
3Y  
2A  
V
CC  
1
2
3
4
8
7
6
5
•
•
•
•
•
Supports 5-V VCC Operation  
Max tpd of 3.7 ns at 3.3 V  
1Y  
3A  
2Y  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
GND  
Input and Open-Drain Output Accepts  
Voltages up to 5.5 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
•
•
•
•
•
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
4
3
2
1
5
6
7
8
GND  
2A  
2Y  
3A  
1Y  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
3Y  
1A  
V
CC  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC3G07YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC3G07YZAR  
SN74LVC3G07YEPR  
SN74LVC3G07YZPR  
Reel of 3000  
_ _ _CV_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC3G07DCTR  
SN74LVC3G07DCUR  
SN74LVC3G07DCUT  
C07_ _ _  
C07_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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SN74LVC3G07DCURE4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC3G07QDCURQ1 TI

完全替代

 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
SN74LVC3G07DCUTG4 TI

完全替代

 TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS
SN74LVC3G07DCUR TI

完全替代

 TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS

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