SN74LVC3G07-Q1
www.ti.com .................................................................................................................................................... SCES616B–OCTOBER 2004–REVISED APRIL 2008
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
1
FEATURES
•
•
•
•
•
•
Qualified for Automotive Applications
•
•
•
•
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
Supports 5-V VCC Operation
Ioff Supports Partial-Power-Down Mode
Operation
Max tpd of 3.7 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Input and Open-Drain Output Accepts
Voltages up to 5.5 V
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
•
Typical VOLP (Output Ground Bounce) <0.8 V at
VCC = 3.3 V, TA = 25°C
1000-V Charged-Device Model (C101)
DCU PACKAGE
(TOP VIEW)
VCC
1
2
3
4
8
7
6
5
1A
3Y
1Y
3A
2Y
2A
GND
See mechanical drawing for dimensions.
DESCRIPTION/ORDERING INFORMATION
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
–40°C to 125°C
VSSOP – DCU
Reel of 3000
SN74LVC3G07QDCURQ1
C07_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT
A
OUTPUT
Y
H
L
H
L
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated