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SN74LVC3G07-Q1 PDF预览

SN74LVC3G07-Q1

更新时间: 2024-11-16 12:22:27
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德州仪器 - TI 驱动器输出元件
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9页 270K
描述
TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74LVC3G07-Q1 数据手册

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SN74LVC3G07-Q1  
www.ti.com .................................................................................................................................................... SCES616BOCTOBER 2004REVISED APRIL 2008  
TRIPLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
1
FEATURES  
Qualified for Automotive Applications  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
Supports 5-V VCC Operation  
Ioff Supports Partial-Power-Down Mode  
Operation  
Max tpd of 3.7 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Input and Open-Drain Output Accepts  
Voltages up to 5.5 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Typical VOLP (Output Ground Bounce) <0.8 V at  
VCC = 3.3 V, TA = 25°C  
1000-V Charged-Device Model (C101)  
DCU PACKAGE  
(TOP VIEW)  
VCC  
1
2
3
4
8
7
6
5
1A  
3Y  
1Y  
3A  
2Y  
2A  
GND  
See mechanical drawing for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation.  
The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
–40°C to 125°C  
VSSOP – DCU  
Reel of 3000  
SN74LVC3G07QDCURQ1  
C07_  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
FUNCTION TABLE  
(EACH BUFFER/DRIVER)  
INPUT  
A
OUTPUT  
Y
H
L
H
L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2008, Texas Instruments Incorporated  

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