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SN74LVC1G07DCK PDF预览

SN74LVC1G07DCK

更新时间： 2024-11-02 19:46:11
品牌 Logo 应用领域
德州仪器 - TI 输入元件光电二极管逻辑集成电路
页数 文件大小 规格书
6页 81K
描述
LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, PLASTIC, SOT-5

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SN74LVC1G07DCK 技术参数

生命周期：Obsolete零件包装代码：SOT
包装说明：TSSOP, TSSOP5/6,.08针数：5
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.25系列：LVC/LCX/Z
JESD-30 代码：R-PDSO-G5长度：2 mm
逻辑集成电路类型：BUFFER功能数量：1
输入次数：1端子数量：5
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：OPEN-DRAIN封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装等效代码：TSSOP5/6,.08
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）：8.3 ns认证状态：Not Qualified
座面最大高度：1.1 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
宽度：1.25 mmBase Number Matches：1

SN74LVC1G07DCK 数据手册

 浏览型号SN74LVC1G07DCK的Datasheet PDF文件第2页浏览型号SN74LVC1G07DCK的Datasheet PDF文件第3页浏览型号SN74LVC1G07DCK的Datasheet PDF文件第4页浏览型号SN74LVC1G07DCK的Datasheet PDF文件第5页浏览型号SN74LVC1G07DCK的Datasheet PDF文件第6页 
SN74LVC1G07  
SINGLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
SCES296K – FEBRUARY 2000 – REVISED SEPTEMBER 2002  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar and NanoFree Packages  
Supports 5-V V  
Operation  
CC  
NC  
A
GND  
V
Y
1
2
3
5
4
CC  
Input and Open-Drain Output Accept  
Voltages up to 5.5 V  
Max t of 4.2 ns at 3.3 V  
pd  
Low Power Consumption, 10 µA Max I  
±24-mA Output Drive at 3.3 V  
NC – No internal connection  
CC  
YEA OR YZA PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2
GND  
A
DNU  
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
1 5  
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
DNU – Do not use  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single buffer/driver is designed for 1.65-V to 5.5-V V  
operation.  
CC  
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to  
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial-power-down applications using I .The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
PACKAGE  
T
A
‡
NanoStar  
WCSP (DSBGA) – YEA (Lead)  
Tape and reel  
Tape and reel  
SN74LVC1G07YEAR  
_ _ _CV_  
NanoFree  
SN74LVC1G07YZAR  
–40°C to 85°C  
WCSP (DSBGA) – YZA (Lead-free)  
SOT (SOT-23) – DBV  
Tape and reel  
Tape and reel  
SN74LVC1G07DBVR  
SN74LVC1G07DCKR  
C07_  
CV_  
SOT (SC-70) – DCK  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright 2002, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
123456

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