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ꢇꢎ ꢏꢐꢈ ꢎꢇꢆꢑꢒ ꢓ ꢉ ꢔ ꢐꢅꢕ ꢆ ꢉ ꢐꢎ ꢖꢐ ꢋ ꢖ ꢓꢆ ꢗ ꢘꢇꢆ ꢕꢙ ꢇꢓ ꢚꢓꢛꢜ ꢝꢓꢗ ꢘꢇꢆꢕ ꢙ ꢇꢓ ꢚꢓ ꢛ
SCDS060F − MARCH 1998 − REVISED OCTOBER 2003
DGG PACKAGE
(TOP VIEW)
D
D
D
D
4-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
I
Supports Partial-Power-Down Mode
1A
2B1
2B2
3A
1B1
1B2
2A
3B1
3B2
4A
off
1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Operation
2
Break-Before-Make Feature
3
4
description/ordering information
4B1
4B2
5A
6B1
6B2
7A
8B1
8B2
GND
5
6
The SN74CBTLV16235 is an 18-bit 1-of-2 FET
multiplexer/demultiplexer used in applications in
which two separate data paths must be
multiplexed onto, or demultiplexed from, a single
path. This device can be used for memory
interleaving, where two different banks of memory
need to be addressed simultaneously.
5B1
5B2
6A
7B1
7B2
8A
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
GND
VCC
9B1
9B2
10A
11B1
11B2
12A
13B1
13B2
14A
15B1
15B2
16A
17B1
17B2
18A
GND
S0
The device is organized as a dual 9-bit 1-of-2
multiplexer/demultiplexer with separate control
inputs. It can be used as two 9-bit
multiplexers/demultiplexers or as one 18-bit
multiplexer/demultiplexer. Two select (S0 and S1)
inputs control the data flow. When the test (T0 and
T1) inputs are asserted, port A is connected to
both ports B1 and B2. The control inputs can be
driven with a low-voltage TTL or an SSTL_3
driver.
V
CC
9A
10B1
10B2
11A
12B1
12B2
13A
14B1
14B2
15A
16B1
16B2
17A
The SN74CBTLV16235 is specified by the
break-before-make design to have no through
current when switching directions.
This
device
is
fully
specified
for
18B1
18B2
GND
T0
partial-power-down applications using I . The I
off
off
feature ensures that damaging current will not
backflow through the device when it is powered
down. The device has isolation during power off.
T1
S1
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
−40°C to 85°C TSSOP − DGG Tape and reel
SN74CBTLV16235GR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
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