SN74AVC2T45
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES531I–DECEMBER 2003–REVISED JANUARY 2007
FEATURES
DCT OR DCU PACKAGE
•
•
•
Available in the Texas Instruments
NanoFree™ Package
(TOP VIEW)
V
V
CCB
1
2
3
4
8
7
6
5
Control Inputs VIH/VIL Levels Are Referenced
to VCCA Voltage
CCA
A1
A2
B1
B2
DIR
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
GND
•
•
I/Os Are 4.6-V Tolerant
YZP PACKAGE
(BOTTOM VIEW)
Ioff Supports Partial-Power-Down Mode
Operation
D1
C1
D2
C2
4
3
2
1
5
6
7
8
GND
A2
DIR
B2
B1
V
•
Max Data Rates
–
–
–
–
–
500 Mbps (1.8-V to 3.3-V Translation)
320 Mbps (<1.8-V to 3.3-V Translation)
320 Mbps (Translate to 2.5 V or 1.8 V)
280 Mbps (Translate to 1.5 V)
B1
A1
B2
A2
A1
V
CCA
CCB
240 Mbps (Translate to 1.2 V)
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
–
–
–
8000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
SN74AVC2T45YZPR
_ _ _TD_
–40°C to 85°C
Reel of 3000
Reel of 3000
SN74AVC2T45DCTR
SN74AVC2T45DCUR
DT2_ _ _
DT2_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.