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SN74AVC2T872YFPR

更新时间： 2024-11-29 06:12:55
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德州仪器 - TI /
页数 文件大小 规格书
18页 281K
描述
VOLTAGE-LEVEL SHIFTER FOR IC-USB INTERFACE

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SN74AVC2T872  
www.ti.com........................................................................................................................................................................................... SCES710–NOVEMBER 2008  
VOLTAGE-LEVEL SHIFTER FOR IC-USB INTERFACE  
1
FEATURES  
YFP PACKAGE  
(TOP VIEW)  
•
VCCA, VCCB Supply Voltage: 1.1 V to 3.6 V  
•
When VCCB = 0 V, A-Port is Disabled and  
B-Port is Held at GND Through 120-kΩ  
Pulldown  
1
2
3
A
B
C
D
•
•
Crossover Skew of <1 ns  
Meets All Requirements of the IC-USB  
Standard  
•
•
Small Package: 0.4 mm pitch WCSP  
(1.2 mm × 1.6 mm)  
1
2
3
A
B
C
D
PD_EN  
D+(A)  
D–(A)  
DIR  
VCCA  
VCCA  
GND  
GND  
VCCB  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II ESD Performance  
D+(B)  
D–(B)  
DIR_POL  
–
–
A-Port (Host Side)  
–
–
2000-V Human-Body Model  
1000-V Charged-Device Model  
B-Port (Peripheral Side)  
–
–
8000-V Contact Discharge  
15000-V Air-Gap Discharge  
DESCRIPTION/ORDERING INFORMATION  
The SN74AVC2T872 is a 2-bit voltage level translator optimized for use in interchip USB (IC-USB) applications.  
VCCA and VCCB can each operate over the full range of 1.1 V to 3.6 V. The device has been designed to maintain  
crossover skew to be less than 1 ns. Each B-port has an integrated 120-kΩ pulldown resistor that can be  
enabled and disabled using the PD_EN control signal. If VCCB = 0 V, the A-port I/Os are disabled (Hi-Z) and the  
B-port I/Os are held to GND through the 120-kΩ resistors. If VCCA = 0 V, the A-port and B-port I/Os are disabled  
(Hi-Z).  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
_ _ _ TU _  
–40°C to 85°C  
WCSP – YFP Reel of 3000  
SN74AVC2T872YFPR  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...18

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