SN74AUC2G07
www.ti.com............................................................................................................................................................... SCES443D–MAY 2003–REVISED JUNE 2008
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
1
FEATURES
2
•
Available in the Texas Instruments NanoFree™
Package
•
•
•
Low Power Consumption, 10 µA at 1.8 V
±8-mA Output Drive at 1.8 V
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
•
Ioff Supports Partial-Power-Down Mode
Operation
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
•
•
Sub-1-V Operable
1000-V Charged-Device Model (C101)
Max tpd of 2.5 ns at 1.8 V
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
2
1
4
5
6
2Y
2A
GND
1A
1A
GND
2A
1Y
1
2
3
6
5
4
1
2
3
6
1A
GND
2A
1Y
VCC
1Y
VCC
2Y
VCC
2Y
5
4
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC2G07YZPR
_ _ _UV_
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
Reel of 3000
SN74AUC2G07DBVR
SN74AUC2G07DBVT
SN74AUC2G07DCKR
–40C to 85C
U07_
UV_
SOT (SC-70) – DCK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated