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SN74AUC2G07_09 PDF预览

SN74AUC2G07_09

更新时间: 2024-11-24 09:15:23
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 595K
描述
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUC2G07_09 数据手册

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SN74AUC2G07  
www.ti.com............................................................................................................................................................... SCES443DMAY 2003REVISED JUNE 2008  
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS  
1
FEATURES  
2
Available in the Texas Instruments NanoFree™  
Package  
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
Ioff Supports Partial-Power-Down Mode  
Operation  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 2.5 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
2Y  
2A  
GND  
1A  
1A  
GND  
2A  
1Y  
1
2
3
6
5
4
1
2
3
6
1A  
GND  
2A  
1Y  
VCC  
1Y  
VCC  
2Y  
VCC  
2Y  
5
4
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000  
SN74AUC2G07YZPR  
_ _ _UV_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74AUC2G07DBVR  
SN74AUC2G07DBVT  
SN74AUC2G07DCKR  
–40C to 85C  
U07_  
UV_  
SOT (SC-70) – DCK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2003–2008, Texas Instruments Incorporated  

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