SN74AUC2G125
DUAL BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCES532A–DECEMBER 2003–REVISED MARCH 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1
2
3
4
8
7
6
5
1OE
1A
2Y
V
CC
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
2OE
1Y
2A
GND
•
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
•
•
Sub-1-V Operable
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Max tpd of 1.8 ns at 1.8 V
Low Power Consumption, 10 µA at 1.8 V
±8-mA Output Drive at 1.8 V
4
3
2
1
5
6
7
8
GND
2Y
2A
1Y
1A
1OE
2OE
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V
CC
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V
VCC operation.
The SN74AUC2G125 features dual line drivers with 3-state outputs. The outputs are disabled when the
associated output-enable (OE) input is high.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel SN74AUC2G125YEPR
_ _ _UM_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel SN74AUC2G125YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel SN74AUC2G125DCTR
Tape and reel SN74AUC2G125DCUR
U25_ _ _
UM_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.