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ꢊ ꢅꢆꢋꢌ ꢍꢎꢏ ꢏ ꢐꢑꢀ ꢋꢁꢒ ꢌ ꢓꢁꢐ ꢒ ꢑꢓ ꢔ ꢐꢑ
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SCLS306C − JANUARY 1996 − REVISED AUGUST 2003
SN54HCT541 . . . J OR W PACKAGE
SN74HCT541 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current 3-State Outputs Interface
Directly With System Bus or Can Drive Up
To 15 LSTTL Loads
OE1
A1
A2
A3
A4
A5
A6
A7
A8
V
CC
OE2
Y1
1
2
3
4
5
6
7
8
9
20
19
18
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
CC
Typical t = 12 ns
pd
6-mA Output Drive at 5 V
17 Y2
16 Y3
15 Y4
14 Y5
13 Y6
12 Y7
11 Y8
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Data Flow-Through Pinout (All Inputs on
Opposite Side From Outputs)
GND 10
description/ordering information
SN54HCT541 . . . FK PACKAGE
(TOP VIEW)
These octal buffers and line drivers are designed
to have the performance of the popular ’HC240
series devices and to offer a pinout with inputs and
outputs on opposite sides of the package. This
arrangement greatly facilitates printed circuit
board layout.
3
2
1
20 19
18
Y1
Y2
Y3
A3
A4
A5
A6
A7
4
5
6
7
8
17
16
The 3-state control gate is a 2-input NOR. If either
output-enable (OE1 or OE2) input is high, all eight
outputs are in the high-impedance state. The
’HCT541 devices provide true data at the outputs.
15 Y4
14
Y5
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT541N
SN74HCT541N
SN74HCT541DW
SN74HCT541DWR
SN74HCT541NSR
SN74HCT541DBR
SN74HCT541PW
SN74HCT541PWR
SN74HCT541PWT
SNJ54HCT541J
SOIC − DW
HCT541
SOP − NS
HCT541
HT541
−40°C to 85°C
SSOP − DB
TSSOP − PW
HT541
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT541J
SNJ54HCT541W
SNJ54HCT541W
SNJ54HCT541FK
−55°C to 125°C
SNJ54HCT541FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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