SMG1330N
2.0A , 30V , RDS(ON) 58 mΩ
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
SC-59
DESCRIPTION
These miniature surface mount MOSFETs
utilize a high cell density trench process to provide low
RDS(ON) and to ensure minimal power loss and heat dissipation.
A
L
3
3
Top View
C B
1
FEATURES
1
2
2
K
F
E
ꢀ
ꢀ
ꢀ
ꢀ
Low RDS(on) provides higher efficiency and extends battery life.
Low thermal impedance copper leadframe SC59 saves board space.
Fast switching speed.
D
High performance trench technology.
H
J
G
Millimeter
Min. Max.
Millimeter
Min. Max.
0.10 REF.
0.40 REF.
REF.
REF.
APPLICATION
A
B
C
D
2.70
2.25
1.30
1.00
3.10
3.00
1.70
1.40
G
H
J
DC-DC converters and power management in
portable and battery-powered products such as computers,
printers, PCMCIA cards, cellular and cordless telephones.
0.10
0.20
K
0.45
0.55
E
F
1.70
0.35
2.30
0.50
L
0.85
1.15
TOP VIEW
PACKAGE INFORMATION
Package
MPQ
Leader Size
1
SC-59
3K
7 inch
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
VDS
Ratings
30
Unit
V
Drain-Source Voltage
Gate-Source Voltage
VGS
±20
V
TA=25°C
TA=70°C
2.0
A
Continuous Drain Current 1
Pulsed Drain Current 2
ID
1.7
A
IDM
IS
±20
A
Continuous Source Current (Diode Conduction) 1
TA=25°C
TA=70°C
Operating Junction and Storage Temperature Range
1.6
A
0.34
0.22
-55~150
W
W
°C
Power Dissipation 1
PD
TJ, TSTG
Thermal Resistance Ratings
t ≦ 5 sec
100
166
Maximum Junction to Ambient 1
Notes:
Rθ
JA
°C / W
Steady State
1
2
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
29-Aug-2011 Rev. A
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