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SMBJP6KE11CAHE3-TP PDF预览

SMBJP6KE11CAHE3-TP

更新时间: 2023-03-15 00:00:00
品牌 Logo 应用领域
美微科 - MCC 局域网光电二极管
页数 文件大小 规格书
5页 566K
描述
Trans Voltage Suppressor Diode, 600W, 9.4V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AA, SMBJ, 2 PIN

SMBJP6KE11CAHE3-TP 技术参数

生命周期:Active包装说明:R-PDSO-C2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.35
其他特性:EXCELLENT CLAMPING CAPABILITY, UL RECOGNIZED最大击穿电压:11.6 V
最小击穿电压:10.5 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
最大非重复峰值反向功率耗散:600 W元件数量:1
端子数量:2最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性:BIDIRECTIONAL参考标准:AEC-Q101
最大重复峰值反向电压:9.4 V表面贴装:YES
技术:AVALANCHE端子形式:C BEND
端子位置:DUAL

SMBJP6KE11CAHE3-TP 数据手册

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M C C  
SMBJP6KE6.8(C)AHE3  
THRU  
SMBJP6KE550(C)AHE3  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
Features  
Halogen free  
·
Transient  
Voltage Suppressor  
6.8 to 550 Volts  
600 Watt  
For surface mount applicationsin in order to optimize board space  
Available in both unidirectional and bidirectional construction  
and suffix"C" designates bidirectional type  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Fast response time: typical less than 1.0ps from 0 volts to  
VBR minimum  
Low inductance  
Meet AEC-Q101 Requirement  
Excellent clamping capability  
UL Recognized File # E331408  
DO-214AA  
(SMBJ) (LEAD FRAME)  
Mechanical Data  
Epoxy meets UL 94 V-0 flammability rating  
A
Moisture Sensitivity Level 1  
Terminals: solderable per MIL-STD-750, Method 2026  
Manufacturing code added for better tracking  
Polarity: Color band denotes positive end (cathode)  
B
except Bidirectional  
Maximum soldering temperature: 260oC for 10 seconds  
C
Maximum Ratings @ 25oC Unless Otherwise Specified  
F
H
Peak Pulse Current on  
10/1000us waveform  
Peak Pulse Power  
Dissipation  
Operation And Storage TJ, TSTG  
Temperature Range  
Thermal Resistance  
IPP  
See Table 1 Note: 2  
D
G
PPP  
600W  
Note: 2,  
E
-55oC to  
+175oC  
25O C/W  
20OC/W  
DIMENSIONS  
RthJC  
RthJL  
INCHES  
MIN  
MM  
MIN  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
DIM  
A
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
B
C
D
E
F
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
G
H
0.05  
2. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25oC per Fig.2.  
SUGGESTED SOLDER  
PAD LAYOUT  
0.106"  
0.082”  
0.050”  
www.mccsemi.com  
Revision: A  
2015/03/31  
1 of 5  

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