SMBJ5919B-TP-HF

更新时间： 2024-09-15 13:13:39

品牌	Logo	应用领域
美微科 - MCC		稳压二极管
页数	文件大小	规格书
2页	355K
描述
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中文翻译

获取价格

数据手册

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SMBJ5919B-TP-HF 数据手册

M C C

SMBJ5913

THRU

SMBJ5956

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

21201 Itasca Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

Silicon

3.0 Watt

Zener Diode

Surface Mount Applications

3.3 thru 200 Volt Voltage Range

Ideal For High Density, Low Profile Mounting

Withstands Large Surge Stresses

Available on Tape and Reel

DO-214AA

(SMBJ) (Round Lead)

Mechanical Data

CASE: JEDEC DO-214AA molded Surface Mountable

Terminals solderable per MIL-STD-750, Method 2026

Polarity is indicated by cathode band

Cathode Band

Packaging: Standard 12mm Tape (see EIA 481)

Maximum temperature for soldering: 260^OC for 10 seconds

For surface mount applications with flame retardent epoxy

Meeting UL94V-0

Maximum Ratings

Steady State

25^OC Unless Otherwise Specified

P_(AV)

3.0W

(Note:1)

Power

Dissipation

DIMENSIONS

Operation And

Storage

Temperature

Thermal

INCHES

MIN

.078

.075

.002

-----

.035

.065

.205

.160

.130

MIN

1.98

1.90

.05

-----

.90

1.65

5.21

4.06

3.30

-55^OC to

+150^OC

25^OC/W

DIM

MAX

.116

.089

.008

.02

.055

.091

.224

.180

.155

MAX

2.95

2.25

.20

NOTE

T_J, T_STG

.51

1.40

2.32

5.69

4.57

3.94

Resistance

NOTE:

Mounted on 4.0mm²copper pads to each terminal.

Lead temperature at T_L=75^oC

SUGGESTED SOLDER

PAD LAYOUT

0.090"

0.085”

0.070”

www.mccsemi.com

中文翻译

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