SMB10(8)J5.0(C) thru SMB10(8)J40(C)A
Vishay General Semiconductor
High Power Density Surface Mount TRANSZORB®
Transient Voltage Suppressors
FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Available in Unidirectional and Bidirectional
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020C, LF max peak
DO-214AA (SMB)
of 260 °C
• Solder Dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
Use in sensitive electronics protection against voltage
transients induced by inductive load switching and
MAJOR RATINGS AND CHARACTERISTICS
lighting on ICs, MOSFET, signal lines of sensor units
for consumer, computer, industrial, automotive and
telecommunication.
VWM
5.0 V to 40 V
1000 W
800 W
P
PPM (Unidirectional)
P
PPM (Bidirectional)
MECHANICAL DATA
Case: DO-214AA (SMBJ)
Epoxy meets UL 94V-0 flammability rating
IFSM (Unidirectional only)
Tj max.
100 A
150 °C
Terminals: Matte tin plated leads, solderable per
J-STD-002B and JESD22-B102D
E3 suffix for commercial grade, HE3 suffix for high
reliability grade (AEC Q101 qualified)
Polarity: For unidirectional types the color band
denotes cathode end, no marking on bidirectional
types
MAXIMUM RATINGS (T = 25 °C unless otherwise noted)
A
PARAMETER
SYMBOL
VALUE
UNIT
Peak pulse power dissipation with a 10/1000 µs
waveform (1,2) (see Fig. 1)
Unidirectional
Bidirectional
1000
800
PPPM
W
Peak pulse current with a 10/1000 µs waveform (1)
Peak forward surge current 8.3 ms single half sine-wave uni-directional only (2)
IPPM
IFSM
see next table
100
A
A
Operating junction and storage temperature range
TJ, TSTG
- 55 to + 150
°C
Note:
(1) Non-repetitive current pulse, per Fig. 3 and derated above TA = 25 °C per Fig. 2
(2) Mounted on 0.2 x 0.2" (5.0 x 5.0 mm) copper pads to each terminal
Document Number 88422
12-Sep-06
www.vishay.com
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