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SKIIP31NAB06 PDF预览

SKIIP31NAB06

更新时间: 2024-11-12 22:29:11
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
4页 361K
描述
3-phase bridge rectifier + braking chopper + 3-phase bridge inverter

SKIIP31NAB06 技术参数

生命周期:Obsolete包装说明:SPECIAL SHAPE, R-XXSS-X22
针数:22Reach Compliance Code:unknown
风险等级:5.82外壳连接:ISOLATED
最大集电极电流 (IC):50 A集电极-发射极最大电压:600 V
配置:COMPLEX门极-发射极最大电压:20 V
JESD-30 代码:R-XXSS-X22元件数量:7
端子数量:22最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SPECIAL SHAPE极性/信道类型:N-CHANNEL
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UNSPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):880 ns
标称接通时间 (ton):140 nsVCEsat-Max:2.7 V

SKIIP31NAB06 数据手册

 浏览型号SKIIP31NAB06的Datasheet PDF文件第2页浏览型号SKIIP31NAB06的Datasheet PDF文件第3页浏览型号SKIIP31NAB06的Datasheet PDF文件第4页 
SKiiP 31 NAB 06  
MiniSKiiP 3  
SEMIKRON integrated  
intelligent Power  
Absolute Maximum Ratings  
Symbol  
Conditions 1)  
Values  
Units  
SKiiP 31 NAB 06  
Inverter  
3-phase bridge rectifier +  
braking chopper +  
3-phase bridge inverter  
VCES  
VGES  
IC  
600  
± 20  
50 / 35  
100 / 70  
57 / 38  
114 / 76  
V
V
A
A
A
A
Theatsink = 25 / 80 °C  
ICM  
IF = –IC  
tp < 1 ms; Theatsink = 25 / 80 °C  
Theatsink = 25 / 80 °C  
IFM = –ICM tp < 1 ms; Theatsink = 25 / 80 °C  
Case M3  
Bridge Rectifier  
VRRM  
800  
25  
V
A
ID  
Theatsink = 80 °C  
IFSM  
tp = 10 ms; sin. 180 °, Tj = 25 °C  
tp = 10 ms; sin. 180 °, Tj = 25 °C  
370  
680  
A
I2t  
A2s  
Tj  
Tstg  
Visol  
– 40 . . . + 150  
– 40 . . . + 125  
2500  
°C  
°C  
V
AC, 1 min.  
Characteristics  
Symbol  
Conditions 1)  
min.  
typ.  
max. Units  
IGBT - Inverter  
VCEsat  
td(on)  
tr  
td(off)  
tf  
Eon + Eoff  
Cies  
Rthjh  
IC = 50 A Tj = 25 (125) °C  
CC = 300 V; VGE = ± 15 V  
IC = 50 A; Tj = 125 °C  
gon = Rgoff = 22 Ω  
2,1(2,2) 2,7(2,8)  
V
ns  
ns  
ns  
ns  
mJ  
nF  
K/W  
V
60  
80  
120  
160  
500  
830  
R
330  
550  
7,3  
2,8  
inductive load  
VCE = 25 V; VGE = 0 V, 1 MHz  
per IGBT  
UL recognized file no. E63532  
1,0  
IGBT - Chopper *  
specification of temperature  
sensor see part A  
VCEsat  
td(on)  
tr  
td(off)  
tf  
IC = 30 A Tj = 25 (125) °C  
CC = 300 V; VGE = ± 15 V  
IC = 30 A; Tj = 125 °C  
gon = Rgoff = 33 Ω  
2,1(2,2) 2,7(2,8)  
V
ns  
ns  
ns  
ns  
mJ  
nF  
K/W  
common characteristics see  
V
50  
80  
100  
160  
370  
750  
page B16–3  
R
250  
500  
4,0  
1,6  
inductive load  
Options  
Eon + Eoff  
Cies  
Rthjh  
also available with faster IGBTs  
(type ... 063), data sheet on  
request  
VCE = 25 V; VGE = 0 V, 1 MHz  
per IGBT  
1,4  
Diode 2) - Inverter & Chopper  
VF = VEC IF = 50 A Tj = 25 (125) °C  
1,45(1,4) 1,7(1,7)  
V
V
mΩ  
A
µC  
mJ  
K/W  
1)  
Theatsink = 25 °C, unless  
otherwise specified  
CAL = Controlled Axial Lifetime  
Technology (soft and fast  
recovery)  
VTO  
rT  
Tj = 125 °C  
Tj = 125 °C  
0,85  
11  
50  
0,9  
16  
2)  
IRRM  
Qrr  
IF = 50 A, VR = – 300 V  
diF/dt = – 800 A/µs  
5,0  
1,5  
1,2  
Eoff  
Rthjh  
VGE = 0 V, Tj = 125 °C  
per diode  
Diode - Rectifier  
VF  
Rthjh  
IF = 25 A, Tj = 25 °C  
per diode  
1,2  
2,6  
V
K/W  
Temperature Sensor  
RTS  
T = 25 / 100 °C  
1000 / 1670  
Mechanical Data  
M1  
case to heatsink, SI Units  
2
2,5  
Nm  
Case  
mechanical outline see page  
B 16 – 9  
M3  
* For diagrams of the Chopper IGBT please refer to SKiiP 22 NAB 06  
© by SEMIKRON 0898  
B 16 – 31  

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