SKCD 61 C 060 I3
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
Tj = 25 °C, IR = 0.2 mA
Ts = 80 °C, Tj = 150 °C
VRRM
IF(AV)
IFSM
600
75
V
A
Tj = 25 °C
Tj = 150 °C
A
10 ms
sin 180°
1000
150
A
Tjmax
°C
Electrical Characteristics
Symbol Conditions
CAL-DIODE
min.
typ.
max.
Unit
IF = 100 A
i2t
IR
5000
0.20
6.00
1.60
1.60
A2s
mA
mA
V
Tj = 150 °C, 10 ms, sin 180°
Tj = 25 °C, VRRM = 600 V
VRRM = 600 V
Tj = 125 °C, VRRM = 600 V
Tj = 25 °C, IF = 110 A
Tj = 125 °C, IF = 110 A
Tj = 125 °C
Size: 7,8 mm x 7,8 mm
VF
1.35
1.35
0.90
3.8
V
V(TO)
rT
V
SKCD 61 C 060 I3
Tj = 125 °C
mΩ
Dynamic Characteristics
Symbol Conditions
Features
• low forward voltage drop combined
with a low temperature dependence
• easy paralleling due to a small forward
voltage spread
• very soft recovery behavior
• small switching losses
min.
typ.
max.
Unit
Tj = 25 °C, 100 A, 300 V, 800 A/µs
trr
µs
ns
µC
µC
A
Tj = 125 °C, 100 A, 300 V, 800 A/µs
Tj = 25 °C, 100 A, 300 V, 800 A/µs
Tj = 125 °C, 100 A, 300 V, 800 A/µs
Tj = 25 °C, 100 A, 300 V, 800 A/µs
Tj = 125 °C, 100 A, 300 V, 800 A/µs
trr
Qrr
Qrr
Irrm
Irrm
3
7
• high ruggedness
• compatible to thick wire bonding
• compatible to all standard solder
processes
60
A
Typical Applications*
• freewheeling diode for IGBT
Thermal Characteristics
Symbol Conditions
min.
typ.
max.
Unit
Tj
-40
-40
150
150
250
320
°C
°C
°C
°C
Tstg
Tsolder
Tsolder
10 min.
5 min.
sold. on 0,38 mm DCB, reference point
on copper heatsink close to the chip
Rth(j-s)
0.54
K/W
Mechanical Characteristics
Symbol Conditions
Values
Unit
Raster
size
7.8 x 7.8
mm2
mm2
Area total
Anode
60.84
bondable (Al)
Cathode
Wire bond
Package
solderable (Ag/Ni)
Al, diameter ≤ 500 µm
wafer frame
Chips /
Package
156 (5" Wafer)
pcs
SKCD
© by SEMIKRON
Rev. 0 – 18.02.2010
1