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SKCD81C065I4F PDF预览

SKCD81C065I4F

更新时间: 2024-11-14 20:10:07
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 二极管
页数 文件大小 规格书
2页 171K
描述
Rectifier Diode, 1 Element, 200A, 650V V(RRM),

SKCD81C065I4F 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.76
配置:SINGLE二极管类型:RECTIFIER DIODE
最大正向电压 (VF):1.49 V最大非重复峰值正向电流:1290 A
元件数量:1最高工作温度:175 °C
最大输出电流:200 A最大重复峰值反向电压:650 V
子类别:Rectifier DiodesBase Number Matches:1

SKCD81C065I4F 数据手册

 浏览型号SKCD81C065I4F的Datasheet PDF文件第2页 
SKCD 81 C 065 I4F  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.15 mA  
VRRM  
IFSM  
650  
1470  
1290  
8321  
175  
V
A
A
A²s  
°C  
Tj = 25 °C  
Tj = 150 °C  
10 ms  
sin 180°  
Tj = 150 °C, tp = 10 ms, sin 180°  
i²t  
Tjmax  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 200 A 1)  
Tc = 80 °C, Tj = 175 °C, Fi=PI/2,  
IF(AV)  
IR  
139  
A
Semitrans Assembly; Rth(j-c) = 0.4 K/W  
Tj = 25 °C, VRRM = 650 V  
Tj = 150 °C, VRRM = 650 V  
Tj = 25 °C, IF = 148 A  
Tj = 150 °C, IF = 148 A  
Tj = 175 °C, IF = 148 A  
Tj = 150 °C  
VRRM = 650 V  
Size: 9 x 9 mm²  
0.15  
44.00  
1.62  
1.56  
1.49  
0.99  
3.85  
0.95  
3.65  
mA  
mA  
V
V
V
V
m  
V
VF  
1.30  
1.24  
1.18  
0.85  
2.64  
0.78  
2.68  
SKCD 81 C 065 I4F  
V(TO)  
rT  
V(TO)  
rT  
Features  
Tj = 150 °C  
Tj = 175 °C  
Tj = 175 °C  
• low forward voltage drop combined  
with a low temperature dependence  
• easy paralleling due to a small forward  
voltage spread  
m  
• very soft recovery behavior  
• small switching losses  
• high ruggedness  
Dynamic Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Typical Applications*  
Tj = 25 °C, 200 A, 400 V, 3000 A/µs  
Err  
Err  
Qrr  
Qrr  
Irrm  
Irrm  
2.1  
5.8  
7.8  
19.7  
130  
196  
mJ  
mJ  
µC  
µC  
A
• freewheeling diode for IGBT  
Tj = 150 °C, 200 A, 400 V, 3000 A/µs  
Tj = 25 °C, 200 A, 400 V, 3000 A/µs  
Tj = 150 °C, 200 A, 400, 3000 A/µs  
Tj = 25 °C, 200 A, 400 V, 3000 A/µs  
Tj = 150 °C, 200 A, 400, 3000 A/µs  
Footnotes  
1) Nominal IGBT IF rating,  
verified by design and characterization  
A
Thermal Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Tj  
Tstg  
Tsolder  
Tsolder  
-40  
-40  
175  
175  
250  
320  
°C  
°C  
°C  
°C  
10 min.  
5 min.  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
Area total  
9 x 9  
mm2  
mm²  
81  
Anode  
Metallization  
Metallization  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, typ. diameter = 300 µm  
150 mm wafer frame  
Chips /  
Package  
179  
pcs  
SKCD  
© by SEMIKRON  
Rev. 0 – 12.06.2012  
1

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