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SIHL510STRL-GE3 PDF预览

SIHL510STRL-GE3

更新时间: 2024-11-12 09:25:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
9页 277K
描述
Power MOSFET

SIHL510STRL-GE3 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.09Is Samacsys:N
其他特性:AVALANCHE RATED, LOGIC LEVEL COMPATIBLE雪崩能效等级(Eas):100 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):5.6 A
最大漏极电流 (ID):5.6 A最大漏源导通电阻:0.54 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):43 W最大脉冲漏极电流 (IDM):18 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHL510STRL-GE3 数据手册

 浏览型号SIHL510STRL-GE3的Datasheet PDF文件第2页浏览型号SIHL510STRL-GE3的Datasheet PDF文件第3页浏览型号SIHL510STRL-GE3的Datasheet PDF文件第4页浏览型号SIHL510STRL-GE3的Datasheet PDF文件第5页浏览型号SIHL510STRL-GE3的Datasheet PDF文件第6页浏览型号SIHL510STRL-GE3的Datasheet PDF文件第7页 
IRL510S, SiHL510S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
100  
• Surface Mount  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• Logic-Level Gate Drive  
• RDS(on) Specified at VGS = 4 V and 5 V  
• 175 °C Operating Temperature  
• Compliant to RoHS Directive 2002/95/EC  
RDS(on) ()  
VGS = 5 V  
0.54  
Qg (Max.) (nC)  
6.1  
2.6  
Q
Q
gs (nC)  
gd (nC)  
3.3  
Configuration  
Single  
D
DESCRIPTION  
D2PAK (TO-263)  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
D
G
S
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
D2PAK (TO-263)  
SiHL510STRL-GE3a  
IRL510STRLPbFa  
SiHL510STL-E3a  
SiHL510S-GE3  
IRL510SPbF  
SiHL510S-E3  
Lead (Pb)-free  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
VDS  
LIMIT  
100  
10  
UNIT  
V
VGS  
5.6  
4.0  
18  
T
C = 25 °C  
Continuous Drain Current  
VGS at 5 V  
ID  
A
TC = 100 °C  
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.29  
0.025  
100  
5.6  
4.3  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
EAR  
mJ  
A
mJ  
Repetiitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TC = 25 °C  
TA = 25 °C  
43  
3.7  
5.5  
PD  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 4.8 mH, Rg = 25 , IAS = 5.6 A (see fig. 12).  
c. ISD 5.6 A, dI/dt 75 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 90380  
S11-1045-Rev. C, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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