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SIHF830ASTL PDF预览

SIHF830ASTL

更新时间: 2024-11-19 06:11:39
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 160K
描述
Power MOSFET

SIHF830ASTL 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.07Is Samacsys:N
雪崩能效等级(Eas):230 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):5 A最大漏极电流 (ID):5 A
最大漏源导通电阻:1.4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e0元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):74 W最大脉冲漏极电流 (IDM):20 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHF830ASTL 数据手册

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IRF830AS, IRF830AL, SiHF830AS, SiHF830AL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
500  
Available  
R
DS(on) (Max.) (Ω)  
VGS = 10 V  
1.40  
RoHS*  
• Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
Qg (Max.) (nC)  
24  
6.3  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
• Fully Characterized Capacitance and Avalanche Voltage  
and Current  
11  
Configuration  
Single  
• Effective Coss specified  
• Lead (Pb)-free Available  
D
I2PAK  
(TO-262)  
D2PAK  
(TO-263)  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• High speed power switching  
G
G
D
S
S
D
G
TYPICAL SMPS TOPOLOGIES  
• Two Transistor Forward  
S
N-Channel MOSFET  
• Half Bridge and Full Bridge  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRF830ASPbF  
D2PAK (TO-263)  
IRF830ASTRLPbFa  
SiHF830ASTL-E3a  
IRF830ASTRLa  
I2PAK (TO-262)  
IRF830ALPbF  
SiHF830AL-E3  
IRF830AL  
Lead (Pb)-free  
SiHF830AS-E3  
IRF830AS  
SnPb  
SiHF830AS  
SiHF830ASTLa  
SiHF830AL  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
500  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
30  
T
C = 25 °C  
5.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
TC =100°C  
3.2  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
20  
0.59  
230  
W/°C  
mJ  
A
EAS  
IAR  
5.0  
Repetiitive Avalanche Energya  
EAR  
7.4  
mJ  
T
A = 25 °C  
3.1  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TC = 25 °C  
74  
Peak Diode Recovery dV/dtc, e  
dV/dt  
5.3  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 18 mH, RG = 25 Ω, IAS = 5.0 A (see fig. 12).  
c. ISD 5.0 A, dI/dt 370 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses SiHF830A data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91062  
S-81352-Rev. A, 16-Jun-08  
www.vishay.com  
1

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