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SIHB8N50D-GE3 PDF预览

SIHB8N50D-GE3

更新时间: 2024-11-24 15:51:15
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
7页 146K
描述
Power Field-Effect Transistor, 8.7A I(D), 500V, 0.85ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, TO-263, D2PAK-3/2

SIHB8N50D-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:compliantFactory Lead Time:6 weeks
风险等级:5.76雪崩能效等级(Eas):29 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):8.7 A最大漏极电流 (ID):8.7 A
最大漏源导通电阻:0.85 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):156 W
最大脉冲漏极电流 (IDM):18 A子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHB8N50D-GE3 数据手册

 浏览型号SIHB8N50D-GE3的Datasheet PDF文件第2页浏览型号SIHB8N50D-GE3的Datasheet PDF文件第3页浏览型号SIHB8N50D-GE3的Datasheet PDF文件第4页浏览型号SIHB8N50D-GE3的Datasheet PDF文件第5页浏览型号SIHB8N50D-GE3的Datasheet PDF文件第6页浏览型号SIHB8N50D-GE3的Datasheet PDF文件第7页 
SiHB8N50D  
Vishay Siliconix  
www.vishay.com  
D Series Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Optimal Design  
550  
VDS (V) at TJ max.  
DS(on) max. at 25 °C ()  
Qg (max.) (nC)  
- Low Area Specific On-Resistance  
- Low Input Capacitance (Ciss  
R
VGS = 10 V  
0.85  
)
30  
4
- Reduced Capacitive Switching Losses  
- High Body Diode Ruggedness  
- Avalanche Energy Rated (UIS)  
• Optimal Efficiency and Operation  
- Low Cost  
Q
gs (nC)  
gd (nC)  
Q
7
Configuration  
Single  
D
- Simple Gate Drive Circuitry  
- Low Figure-of-Merit (FOM): Ron x Qg  
- Fast Switching  
D2PAK (TO-263)  
• Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
G
APPLICATIONS  
• Consumer Electronics  
- Displays (LCD or Plasma TV)  
• Server and Telecom Power Supplies  
- SMPS  
D
G
S
S
N-Channel MOSFET  
• Industrial  
- Welding  
- Induction Heating  
- Motor Drives  
• Battery Chargers  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHB8N50D-GE3  
Lead (Pb)-free and Halogen-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
Gate-Source Voltage AC (f > 1 Hz)  
VDS  
500  
30  
V
VGS  
30  
8.7  
TC = 25 °C  
TC =100 °C  
Continuous Drain Current (TJ = 150 °C)  
VGS at 10 V  
ID  
5.5  
A
Pulsed Drain Currenta  
IDM  
18  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
1.25  
29  
W/°C  
mJ  
W
EAS  
PD  
Maximum Power Dissipation  
156  
Operating Junction and Storage Temperature Range  
Drain-Source Voltage Slope  
Reverse Diode dV/dtd  
TJ, Tstg  
- 55 to + 150  
24  
°C  
TJ = 125 °C  
dV/dt  
V/ns  
°C  
0.37  
300  
Soldering Recommendations (Peak Temperature)c  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature.  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 , IAS = 5 A.  
c. 1.6 mm from case.  
d. ISD ID, starting TJ = 25 °C.  
S13-0025-Rev. A, 21-Jan-13  
Document Number: 91529  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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