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SIGC14T60N PDF预览

SIGC14T60N

更新时间: 2024-11-21 21:12:23
品牌 Logo 应用领域
英飞凌 - INFINEON 功率控制晶体管
页数 文件大小 规格书
4页 67K
描述
Insulated Gate Bipolar Transistor, 20A I(C), 600V V(BR)CES, N-Channel, DIE-2

SIGC14T60N 技术参数

生命周期:Obsolete零件包装代码:DIE
包装说明:DIE-2针数:2
Reach Compliance Code:compliant风险等级:5.63
最大集电极电流 (IC):20 A集电极-发射极最大电压:600 V
配置:SINGLE门极发射器阈值电压最大值:6.5 V
门极-发射极最大电压:20 VJESD-30 代码:S-XUUC-N2
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:SQUARE封装形式:UNCASED CHIP
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):158 ns标称接通时间 (ton):75 ns
Base Number Matches:1

SIGC14T60N 数据手册

 浏览型号SIGC14T60N的Datasheet PDF文件第2页浏览型号SIGC14T60N的Datasheet PDF文件第3页浏览型号SIGC14T60N的Datasheet PDF文件第4页 
Preliminary  
SIGC14T60N  
IGBT Chip in NPT-technology  
C
FEATURES:  
This chip is used for:  
·
·
·
·
600V NPT technology  
100µm chip  
positive temperature coefficient  
easy paralleling  
·
IGBT Modules  
Applications:  
drives  
G
E
·
Chip Type  
VCE  
ICn  
15A  
Die Size  
Package  
Ordering Code  
Q67041-A4689-  
A001  
SIGC14T60N  
600V  
3.80 x 3.80 mm2  
sawn on foil  
MECHANICAL PARAMETER:  
mm2  
Raster size  
3.80 x 3.80  
14.44 / 10.7  
1.89 x 2.19  
0.70 x 1.09  
100  
Area total / active  
Emitter pad size  
Gate pad size  
Thickness  
µm  
mm  
deg  
Wafer size  
125  
Flat position  
0
Max.possible chips per wafer  
Passivation frontside  
Emitter metalization  
703  
Photoimide  
3200 nm Al Si 1%  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metalization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, £500µm  
Reject Ink Dot Size  
tbd  
store in original container, in dry nitrogen,  
< 6 month  
Recommended Storage Environment  
Edited by INFINEON technologies AI IP DD HV2, L 7232-E, Edition 1, 28.04.2000  

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