SiF912EDZ
Vishay Siliconix
SPECIFICATIONS (T = 25_C UNLESS OTHERWISE NOTED)
J
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
V
GS(th)
V
DS
= V , I = 250 mA
0.6
1.5
V
GS
D
V
= 0 V, V = "4.5 V
GS
DS
"10
"500
Gate-Body Leakage
I
GSS
V
= 0 V, V = "12 V
GS
DS
mA
V
= 30 V, V = 0 V
1
5
DS
GS
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V = 0 V, T = 85_C
GS
J
a
On-State Drain Current
I
V
DS
= 5 V, V = 4.5 V
40
A
D(on)
GS
V
= 4.5 V, I =7.4 A
0.0155
0.016
0.019
GS
D
0.0195
V
GS
= 4.0 V, I = 7.3 A
D
a
Drain-Source On-State Resistance
r
W
DS(on)
0.018
0.022
0.022
0.027
V
= 3.1 V, I = 6.8 A
D
GS
V
GS
= 2.5 V, I = 3.5 A
D
a
Forward Transconductance
g
V
= 10 V, I = 7.4 A
37
S
V
fs
DS
D
a
Diode Forward Voltage
V
SD
I
S
= 2.9 A, V = 0 V
0.75
1.1
15
GS
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Q
9.8
2.5
g
Q
Q
V
= 15 V, V = 4.5 V, I = 7.4 A
nC
gs
gd
DS
GS
D
2.9
t
0.53
0.70
8.0
0.8
1.1
12
5
d(on)
t
r
V
DD
= 15 V, R = 15 W
L
ms
I
^ 1 A, V
= 10 V, R = 6 W
Turn-Off Delay Time
Fall Time
t
d(off)
D
GEN g
t
3.4
f
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate-Current vs. Gate-Source Voltage
Gate Current vs. Gate-Source Voltage
16
12
8
100,000
10,000
1,000
100
10
T
= 150_C
J
1
0.1
T
= 25_C
J
4
0.01
0.001
0
0.0001
0
2
4
6
8
10
12
14
16
0
3
6
9
12
52
V
GS
− Gate-to-Source Voltage (V)
V
GS
− Gate-to-Source Voltage (V)
Document Number: 72952
S-50131—Rev. B, 24-Jan-05
www.vishay.com
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