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SI7141DP PDF预览

SI7141DP

更新时间: 2024-09-17 09:25:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 112K
描述
P-Channel 20-V (D-S) MOSFET

SI7141DP 数据手册

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New Product  
Si7141DP  
Vishay Siliconix  
P-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
Definition  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
- 60d  
- 60d  
0.0019 at VGS = - 10 V  
0.0030 at VGS = - 4.5 V  
- 20  
128 nC  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK SO-8  
S
APPLICATIONS  
S
6.15 mm  
5.15 mm  
Adaptor Switch  
Battery Switch  
Load Switch  
1
S
2
S
3
G
G
4
D
8
D
7
D
6
D
5
D
Bottom View  
Ordering Information: Si7141DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
VDS  
Limit  
- 20  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
- 60d  
- 60d  
- 42.7b  
- 34b  
- 100  
- 60d  
- 5.6a, b  
- 40  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
IAS  
Avalanche Current  
L = 0.1 mH  
EAS  
Single-Pulse Avalanche Energy  
80  
mJ  
W
T
T
T
C = 25 °C  
C = 70 °C  
A = 25 °C  
104  
66.6  
PD  
Maximum Power Dissipation  
6.25a, b  
4.0a, b  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
15  
Maximum  
Unit  
Maximum Junction-to-Ambienta, c  
t 10 s  
Steady State  
20  
°C/W  
Maximum Junction-to-Case  
0.9  
1.2  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. Maximum under Steady State conditions is 54 °C/W.  
d. Package limited.  
e. See Solder Profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 65596  
S10-0042-Rev. A, 11-Jan-10  
www.vishay.com  
1

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