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Si7172ADP PDF预览

Si7172ADP

更新时间: 2024-11-26 14:55:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 235K
描述
N-Channel 200 V (D-S) MOSFET

Si7172ADP 数据手册

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Si7172ADP  
Vishay Siliconix  
www.vishay.com  
N-Channel 200 V (D-S) MOSFET  
FEATURES  
PowerPAK® SO-8 Single  
D
• ThunderFET technology optimizes balance  
of RDS(on), Qg, Qsw, and Qoss  
D
7
8
D
6
D
5
• 100 % Rg and UIS tested  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
3
S
S
D
4
G
APPLICATIONS  
• Fixed telecom  
1
Top View  
Bottom View  
• DC/DC converter  
PRODUCT SUMMARY  
VDS (V)  
200  
0.070  
0.080  
15  
• Primary and secondary side switch  
• Synchronous rectification  
G
RDS(on) max. () at VGS = 10 V  
RDS(on) max. () at VGS = 7.5 V  
Qg typ. (nC)  
S
ID (A) a  
17.2  
N-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8  
Lead (Pb)-free and halogen-free  
Si7172ADP-T1-RE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
200  
20  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
VGS  
V
TC = 25 °C  
17.2  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
13.8  
Continuous drain current (TJ = 150 °C)  
ID  
5.3 b, c  
4.2 b, c  
50  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
26  
4.5 b, c  
Continuous source-drain diode current  
Single pulse avalanche current  
Single pulse avalanche Energy  
IAS  
EAS  
15  
11.25  
52  
L = 0.1 mH  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
33  
Maximum power dissipation  
PD  
5 b, c  
3.2 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
20  
1.9  
25  
2.4  
°C/W  
Notes  
a. TC = 25 °C  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 65 °C/W  
S17-1349-Rev. A, 04-Sep-17  
Document Number: 75477  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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