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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| SDINBDG4-16G | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-16G-I | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-16G-XI | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-32G | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-32G-I | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-32G-XI | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-64G | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-64G-I | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-64G-XI | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
| SDINBDG4-8G | ETC |
获取价格 |
Proven Reliability and Endurance for Embedded Platforms |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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