DATA SHEET
SB820FCT~SB8150FCT
ISOLATION SCHOTTKY BARRIER RECTIFIERS
Unit : inch (mm)
ITO-220AB
8 Amperes
CURRENT
VOLTAGE
20 to 150 Volts
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
.189(4.8)
.165(4.2)
.406(10.3)
.381(9.7)
.134(3.4)
.118(3.0)
.130(3.3)
.114(2.9)
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forwrd voltge, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters free wheeling , and polarlity
protection applications.
• Both normal and Pb free product are available :
Normal : 80~95% Sn, 5~20% Pb
.114(2.9)
.098(2.5)
.071(1.8)
.055(1.4)
Pb free: 99% Sn above
.055(1.4)
.039(1.0)
.032(.8)
MAX
MECHANICALDATA
.035(0.9)
.011(0.3)
Case: ITO-220AB full molded plastic package
Terminals: Lead solderable per MIL-STD-202G, Method 208
Polarity: As marked.
.1
(2.55)
.1
(2.55)
AC
AC
Positive CT
Mounting Position: Any
Weight: 0.08 ounces, 2.24grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
SB820
FCT
SB830
FCT
SB840
FCT
SB850
FCT
SB860
FCT
SB880
FCT
SB8100
FCT
SB8150
FCT
PARAMETER
SYMBOL
UNITS
Maximum Recurrent Peak Reverse Voltage
V
V
RRM
RMS
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
150
V
V
V
A
A
V
Maximum RMS Voltage
105
150
Maximum DC Blocking Voltage
V
DC
AV
100
Maximum Average Forward Current .375"(9.5mm)
I
8
lead length at Tc =100O
C
Peak Forward Surge Current :8.3ms single half sine-
wave superimposed on rated load(JEDEC method)
I
FSM
150
Maximum Forward Voltage at 4.0A
V
F
0.55
0.75
0.85
0.92
Maximum DC Reverse Current TA=25O
C
0.5
50
I
R
mA
at Rated DC Blocking Voltage TA=100O
C
Typical Thermal Resistance
RθJC
6
OC / W
Operating Junction Temperature Rang
Storage Temperature Rang
T
J
-50 to +125
-50 to +150
OC
T
J
,TSTG
OC
Note.
Both Bonding and Chip structure are available.
PAGE . 1
STAD-FEB.21.2005