Datasheet > SB10T150L

SB10T150L

更新时间： 2024-11-02 01:05:07

品牌	Logo	应用领域
圣诺 - SENO		/
页数	文件大小	规格书
3页	328K
描述
10A SURFACE MOUNT SCHOTTKY BARRIER DIODE

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数据手册

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SB10T150L 数据手册

Zibo Seno Electronic Engineering Co., Ltd.

SB10T80L-SB10T200L

10A SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Schottky Barrier Chip

Bypass Diodes for Solar Panels

High Junction Temperture

High Thermal Reliability

Patented Super Barrier Rectifier Technology

High Foward Surge Capability

Ultra Low Power Loss, High Efficiency

Excellent High Temperature Stability

Top View

Bottom View

LEFT PIN

BOTTOMSIDE

HEAT SINK

RIGHT PIN

Mechanical Data

Note: Pins Left & Right must

be electrically connected

at the printed circuit board.

Case:TO-277B Molded Plastic "Green" Molding Compound

Terminals: Plated Leads Solderable per

MIL-STD-202, Method 208

Polarity: Cathode Band

Mounting Position: Any

Marking: Type Number

Lead Free: For RoHS/Lead Free Version

Maximum Ratings and Electrical Characteristics ^@T_A^{=25°C unless otherwise specified}

Single Phase, half wave, 60Hz, resistive or inductive load.

For capacitive load, derate current by 20%.

Parameter

Symbol

Unit

10T80L

10T150L

10T200L

10T100L

10T120L

V_RRM

V_RWM

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC blocking voltage

100

120

150

200

140

V_DC

V_R(RMS)

I^O

105

RMS Rectified Voltage

Average Rectified Output Current

(Note1)

Non-Repetitive Peak Forward Surge8.3ms

I^FSM

150

Single Half Sine-Wave Superimposed on rated

load(JEDEC Method)

(Note2)

I²t Rating for Fusing (t < 8.3ms)

²t

²s

93.4

Forward Voltage Drop

Typ

Max.

@IF=1A

@IF=5A

@IF=10A

℃

T_A=25

0.40

0.50

0.47

0.52

0.61

0.71

0.66

V^FM

0.55

0.71 0.76

0.90

0.56 0.62 0.64 0.67 0.77 0.85 0.79 0.88

T =25

Peak Reverse Curent

TA=25 ℃

0.3

I^R

At Rated DC Blocking Voltage

T_A=100 ℃

R_θJA

Typical Thermal Resistance

Junctionto Ambient

℃ /W

℃

RθJL

Operating junction temperature range

storage temperature range

-55 to +150

T^STG

℃

Note:1.Valid Provided that are kept at ambient temperature at a distance of 9.5mm from the case.

2.Fr-4pcb.2oz.Copper,minimum recommend pad layout .18.8mm×14.4.Anode pad dimensions 5.6mm×14.4m

www.senocn.com

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