5秒后页面跳转
捷配首页

Datasheet > 存储 > 其他内存集成电路> S72WS256ND0BFWBB2
S72WS256ND0BFWBB2 PDF预览

S72WS256ND0BFWBB2

更新时间： 2024-02-02 10:54:17
品牌 Logo 应用领域
飞索 - SPANSION 动态存储器内存集成电路
页数 文件大小 规格书
28页 1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

阅读下载

中文翻译

获取价格

S72WS256ND0BFWBB2 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
针数：137Reach Compliance Code：unknown
HTS代码：8542.32.00.71风险等级：5.84
其他特性：MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLEJESD-30 代码：R-PBGA-B137
JESD-609代码：e1长度：12 mm
内存密度：268435456 bit内存集成电路类型：MEMORY CIRCUIT
内存宽度：16湿度敏感等级：3
功能数量：1端子数量：137
字数：16777216 words字数代码：16000000
工作模式：ASYNCHRONOUS最高工作温度：85 °C
最低工作温度：-25 °C组织：16MX16
封装主体材料：PLASTIC/EPOXY封装代码：TFBGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1.2 mm最大供电电压 (Vsup)：1.95 V
最小供电电压 (Vsup)：1.7 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：OTHER端子面层：Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式：BALL端子节距：0.8 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：40
宽度：9 mmBase Number Matches：1

S72WS256ND0BFWBB2 数据手册

 浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第1页浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第3页浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第4页浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第5页浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第6页浏览型号S72WS256ND0BFWBB2的Datasheet PDF文件第7页 
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
Notice On Data Sheet Designations  
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of  
product information or intended specifications throughout the product life cycle, including development,  
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify  
that they have the latest information before finalizing their design. The following descriptions of Spansion data  
sheet designations are presented here to highlight their presence and definitions.  
Advance Information  
The Advance Information designation indicates that Spansion Inc. is developing one or more specific  
products, but has not committed any design to production. Information presented in a document with this  
designation is likely to change, and in some cases, development on the product may discontinue. Spansion  
Inc. therefore places the following conditions upon Advance Information content:  
“This document contains information on one or more products under development at Spansion Inc.  
The information is intended to help you evaluate this product. Do not design in this product without  
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed  
product without notice.”  
Preliminary  
The Preliminary designation indicates that the product development has progressed such that a commitment  
to production has taken place. This designation covers several aspects of the product life cycle, including  
product qualification, initial production, and the subsequent phases in the manufacturing process that occur  
before full production is achieved. Changes to the technical specifications presented in a Preliminary  
document should be expected while keeping these aspects of production under consideration. Spansion  
places the following conditions upon Preliminary content:  
“This document states the current technical specifications regarding the Spansion product(s)  
described herein. The Preliminary status of this document indicates that product qualification has been  
completed, and that initial production has begun. Due to the phases of the manufacturing process that  
require maintaining efficiency and quality, this document may be revised by subsequent versions or  
modifications due to changes in technical specifications.”  
Combination  
Some data sheets contain a combination of products with different designations (Advance Information,  
Preliminary, or Full Production). This type of document distinguishes these products and their designations  
wherever necessary, typically on the first page, the ordering information page, and pages with the DC  
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first  
page refers the reader to the notice on this page.  
Full Production (No Designation on Document)  
When a product has been in production for a period of time such that no changes or only nominal changes  
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include  
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed  
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a  
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following  
conditions to documents in this category:  
“This document states the current technical specifications regarding the Spansion product(s)  
described herein. Spansion Inc. deems the products to have been in sufficient production volume such  
that subsequent versions of this document are not expected to change. However, typographical or  
specification corrections, or modifications to the valid combinations offered may occur.”  
Questions regarding these document designations may be directed to your local sales office.  
2
S72WS-N Based MCP/PoP Products  
S72WS-N_00_A9 May 8, 2007  
1234567...28

中文翻译

下载PDF

与S72WS256ND0BFWBB2相关器件

型号 品牌 获取价格 描述 数据表
S72WS256ND0KFW4Y0 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256ND0KFW4Y2 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256ND0KFW4Y3 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256ND0KFWD3 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256ND0KFWD33 SPANSION

获取价格

 		Memory Circuit, 16MX16, CMOS, PBGA160, 15 X 15 MM, 1.25 MM HEIGHT, LEAD FREE, FBGA-160
S72WS256NDE SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256NDEBAW4Y0 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256NDEBAW4Y2 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256NDEBAW4Y3 SPANSION

获取价格

 		Based MCP/PoP Products
S72WS256NDEBAWU7 SPANSION

获取价格

 		Based MCP/PoP Products

与S72WS256ND0BFWBB2相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证