Datasheet > S72WS256ND0BFW933

S72WS256ND0BFW933

更新时间： 2024-01-10 13:31:06

品牌	Logo	应用领域
飞索 - SPANSION		动态存储器内存集成电路
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

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S72WS256ND0BFW933 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
针数：	137	Reach Compliance Code：	unknown
HTS代码：	8542.32.00.71	风险等级：	5.84
其他特性：	MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	JESD-30 代码：	R-PBGA-B137
JESD-609代码：	e1	长度：	12 mm
内存密度：	268435456 bit	内存集成电路类型：	MEMORY CIRCUIT
内存宽度：	16	湿度敏感等级：	3
功能数量：	1	端子数量：	137
字数：	16777216 words	字数代码：	16000000
工作模式：	ASYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-25 °C	组织：	16MX16
封装主体材料：	PLASTIC/EPOXY	封装代码：	TFBGA
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	260	认证状态：	Not Qualified
座面最大高度：	1.2 mm	最大供电电压 (Vsup)：	1.95 V
最小供电电压 (Vsup)：	1.7 V	标称供电电压 (Vsup)：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	OTHER	端子面层：	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	40
宽度：	9 mm	Base Number Matches：	1

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as

contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal

operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under

the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,

the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under

development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this

document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,

merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any

damages of any kind arising out of the use of the information in this document.

and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes

only and may be trademarks of their respective owners.

S72WS-N Based MCP/PoP Products

S72WS-N_00_A9 May 8, 2007

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与S72WS256ND0BFW933相关器件

型号	品牌	获取价格	描述	数据表
S72WS256ND0BFWB7	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0BFWB70	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWB72	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWBB	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0BFWBB2	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0KFW4Y0	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0KFW4Y2	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0KFW4Y3	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0KFWD3	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0KFWD33	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA160, 15 X 15 MM, 1.25 MM HEIGHT, LEAD FREE, FBGA-160

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