Datasheet > 存储 > 其他内存集成电路> S72WS256ND0BFW932

S72WS256ND0BFW932

更新时间： 2024-01-19 08:37:26

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路存储
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

S72WS256ND0BFW932 数据手册

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第1页

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第2页

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第4页

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第5页

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第6页

浏览型号S72WS256ND0BFW932的Datasheet PDF文件第7页

S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on

Bus 2

Data Sheet (Advance Information)

Features

Power supply voltage of 1.7 to 1.95V

Package:

High Performance

Flash access time: 80 ns for NOR Flash, 25 ns for ORNAND

– 9.0 x 12.0 mm MCP BGA

– 11.0 x 13.0 mm MCP BGA

– 15.0 x 15.0 x 1.2 mm MCP Package-on-Package (PoP)

Flash

Flash burst frequencies: 54 MHz, 66MHz, 80MHz

Operating Temperature

Mobile SDRAM burst frequency: 104 MHz, 133 MHz (DDR)

– –25°C to +85°C (wireless)

General Description

The S72WS series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:

One or two NOR flash memory dies

One NAND Interface ORNAND die

Separate bus for one or more Mobile SDRAM die

The products covered by this document are listed in the table below.

NOR Flash Density

NAND Flash Density

1024Mb 512Mb

SDRAM Density

256Mb

Device

512Mb

256Mb

128Mb

512Mb

128Mb

S72WS256ND0

S72WS256NDE

S72WS256NEE

S72WS512NFG

S72WS512NEG

S72WS512NEF

S72WS512NFF

Note

For a list of PoP OPNs, please contact the local sales representative or refer to the valid combinations tables.

For detailed specifications, please refer to the individual data sheets.

Document

Publication Identification Number (PID)

S29WS-N_00

S30MS-P_00

SDRAM_01

S29WS256N

S30MS01GP/512P

128 Mb Mobile SDRAM Type 1

128 Mb Mobile SDRAM Type 2

128 Mb Mobile DDR-DRAM Type 5

256 Mb Mobile SDRAM Type 2

512 Mb Mobile DDR-DRAM Type 1

512 Mb Mobile SDRAM Type 4

512 Mb NAND Type 1

SDRAM_05

SDRAM_07

SDRAM_05

SDRAM_09

SDRAM_06

NAND_01

512 Mb Mobile DDR-DRAM Type 5

512 Mb Mobile DDR-DRAM Type 2

DRAM_04

DRAM_05

Publication Number S72WS-N_00

Revision A

Amendment 9

Issue Date May 8, 2007

This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in

this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.

1 234 5 6 7...28

下载PDF

与S72WS256ND0BFW932相关器件

型号	品牌	描述	获取价格	数据表
S72WS256ND0BFW933	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWB7	SPANSION	Based MCP/PoP Products	获取价格
S72WS256ND0BFWB70	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWB72	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWBB	SPANSION	Based MCP/PoP Products	获取价格
S72WS256ND0BFWBB2	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格

产品中心

服务支持

精选活动

关于我们

帮助中心

S72WS256ND0BFW932

S72WS256ND0BFW932 数据手册

与S72WS256ND0BFW932相关器件

与S72WS256ND0BFW932相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

S72WS256ND0BFW932

S72WS256ND0BFW932 数据手册

与S72WS256ND0BFW932相关器件

与S72WS256ND0BFW932相关文章

您还可以找

您在本页遇到什么问题？