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S71GL032N80BFW0P3 PDF预览

S71GL032N80BFW0P3

更新时间: 2024-11-29 15:50:23
品牌 Logo 应用领域
飞索 - SPANSION 静态存储器内存集成电路
页数 文件大小 规格书
12页 498K
描述
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

S71GL032N80BFW0P3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
针数:56Reach Compliance Code:unknown
HTS代码:8542.32.00.71风险等级:5.09
其他特性:PSRAM IS ORGANIZED AS 512K X 16JESD-30 代码:R-PBGA-B56
JESD-609代码:e1长度:9 mm
内存密度:33554432 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16湿度敏感等级:3
功能数量:1端子数量:56
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:2MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.1 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:7 mmBase Number Matches:1

S71GL032N80BFW0P3 数据手册

 浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第2页浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第3页浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第4页浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第5页浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第6页浏览型号S71GL032N80BFW0P3的Datasheet PDF文件第7页 
S71GL-N Based MCPs  
Stacked Multi-Chip Product (MCP)  
Flash Memory and RAM  
64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-only  
Page Mode Flash Memory and  
32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM  
S71GL-N Based MCPs Cover Sheet  
Data Sheet (Advance Information)  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S71GL-N_00  
Revision 05  
Issue Date January 20, 2009  

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