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S71GL032N40BHW0K3 PDF预览

S71GL032N40BHW0K3

更新时间: 2024-11-30 04:53:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
12页 361K
描述
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56

S71GL032N40BHW0K3 技术参数

生命周期:Active包装说明:TFBGA,
Reach Compliance Code:compliantHTS代码:8542.32.00.71
风险等级:5.31其他特性:PSRAM IS ORGANIZED AS 256K X 16
JESD-30 代码:R-PBGA-B56长度:9 mm
内存密度:33554432 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16功能数量:1
端子数量:56字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:2MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.1 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:7 mm

S71GL032N40BHW0K3 数据手册

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S71GL-N Based MCPs  
Stacked Multi-Chip Product (MCP)  
Flash Memory and RAM  
64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-Only  
Page Mode Flash Memory and  
32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM  
S71GL-N Based MCPs Cover Sheet  
Data Sheet (Advance Information)  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S71GL-N_00  
Revision 06  
Issue Date January 13, 2010  

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