生命周期: | Active | 包装说明: | TFBGA, |
Reach Compliance Code: | compliant | HTS代码: | 8542.32.00.71 |
风险等级: | 5.31 | 其他特性: | PSRAM IS ORGANIZED AS 256K X 16 |
JESD-30 代码: | R-PBGA-B56 | 长度: | 9 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 56 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 2MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.1 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
宽度: | 7 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S71GL032N40BHW0P0 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FB | |
S71GL032N80 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM | |
S71GL032N80-0K | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM | |
S71GL032N80-0P | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM | |
S71GL032N80BFW0K0 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | |
S71GL032N80BFW0K2 | CYPRESS |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | |
S71GL032N80BFW0K3 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | |
S71GL032N80BFW0P0 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | |
S71GL032N80BFW0P2 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | |
S71GL032N80BFW0P3 | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 |