Datasheet > S71GL032N40-0K

S71GL032N40-0K

更新时间： 2024-11-29 04:32:43

品牌	Logo	应用领域
飞索 - SPANSION		闪存
页数	文件大小	规格书
11页	454K
描述
Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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S71GL032N40-0K 数据手册

S71GL-N Based MCPs

Stacked Multi-Chip Product (MCP)

Flash Memory and RAM

64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-only

Page Mode Flash Memory and

32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM

S71GL-N Based MCPs Cover Sheet

Data Sheet (Advance Information)

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S71GL-N_00

Revision 02

Issue Date June 19, 2007

12 3 4 5 6 7...11

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型号	品牌	获取价格	描述	数据表
S71GL032N40-0P	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL032N40BFW0K0	SPANSION	获取价格	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
S71GL032N40BFW0P0	SPANSION	获取价格	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
S71GL032N40BFW0P2	SPANSION	获取价格	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
S71GL032N40BFW0Z0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL032N40BFW0Z2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL032N40BFW0Z3	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL032N40BHW0K3	CYPRESS	获取价格	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FB
S71GL032N40BHW0P0	SPANSION	获取价格	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FB
S71GL032N80	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM