是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 624 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.9 |
Is Samacsys: | N | JESD-30 代码: | S-CBGA-B624 |
长度: | 32.5 mm | 功能数量: | 1 |
端子数量: | 624 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 5.52 mm |
标称供电电压: | 2.5 V | 表面贴装: | YES |
电信集成电路类型: | ATM/SONET/SDH SUPPORT CIRCUIT | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 32.5 mm | Base Number Matches: | 1 |
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